Product
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MSPM0L1306-Q1
  • MSPM0L1306-Q1
  • MSPM0L1306-Q1
  • MSPM0L1306-Q1
  • MSPM0L1306-Q1
  • MSPM0L1306-Q1
  • MSPM0L1306-Q1

MSPM0L1306-Q1

ACTIVE

Automotive 32-Mhz Arm® Cortex®-M0+ with 64-KB flash, 4-KB RAM, 12-bit ADC, OPA,LIN

Texas Instruments MSPM0L1306-Q1 Product Info

1 April 2026 3

Parameters

CPU

Arm Cortex-M0+

Frequency (MHz)

32

Flash memory (kByte)

64

RAM (kByte)

4

ADC type

12-bit SAR

Features

5-V-tolerant I/Os, AEC Q100, Comparator, DMA, LIN, Zero-drift OpAmp

UART

2

TI functional safety category

Functional Safety-Compliant

Number of ADC channels

6, 8, 9, 10

SPI

1

Operating temperature range (°C)

-40 to 125

Rating

Automotive

Operating system

Not Applicable

Nonvolatile memory (kByte)

64

Number of GPIOs

13, 20, 24, 28

Number of I2Cs

2

Security

Secure debug

Package

SOT-23-THN (DYY)-16-8.4 mm² 4.2 x 2

Features

  • AEC-Q100 qualified for automotive applications

    • Temperature grade 1: –40°C to +125°C, TA

  • Functional Safety Quality-Managed
    • Documentation available to aid in functional safety system design
  • Core
    • Arm 32-bit Cortex-M0+ CPU, frequency up to 32 MHz
  • Operating characteristics
    • Wide supply voltage range: 1.62 V to 3.6 V
  • Memories
    • Up to 64KB of flash
    • Up to 4KB of SRAM
  • High-performance analog peripherals
    • One 12-bit 1.68-Msps analog-to-digital converter (ADC) with up to 10 total external channels
    • Configurable 1.4-V or 2.5-V internal ADC voltage reference (VREF)
    • Two zero-drift, zero-crossover chopper operational amplifiers (OPA)
      • 0.5-µV/°C drift with chopping
      • Integrated programmable gain stage (1-32x)
    • One general-purpose amplifier (GPAMP)
    • One high-speed comparator (COMP) with 8-bit reference DAC
      • 32-ns propagation delay
      • Low power mode down to <1-µA
    • Programmable analog connections between ADC, OPAs, COMP, and DAC
    • Integrated temperature sensor
  • Optimized low-power modes
    • RUN: 71 µA/MHz (CoreMark)
    • STOP: 151 µA at 4 MHz and 44 µA at 32 kHz
    • STANDBY: 1.0 µA with 32-kHz 16-bit timer running, SRAM/registers fully retained, and 32MHz clock wakeup in 3.2µs
    • SHUTDOWN: 61 nA with IO wakeup capability
  • Intelligent digital peripherals
    • 3-channel DMA controller
    • 3-channel event fabric signaling system
    • Four 16-bit general-purpose timers, each with two capture/compare registers supporting low-power operation in STANDBY mode, supporting a total of 8 PWM channels
    • Windowed watchdog timer
  • Enhanced communication interfaces
    • Two UART interfaces; one supporting LIN, IrDA, DALI, Smart Card, Manchester and both supporting low-power operation in STANDBY
    • Two I2C interfaces; one supporting FM+ (1 Mbit/s) and both supporting SMBus, PMBus, and wakeup from STOP
    • One SPI supporting up to 16 Mbit/s
  • Clock system
    • Internal 4- to 32-MHz oscillator with ±1.2% accuracy (SYSOSC)
    • Internal 32-kHz low-frequency oscillator with ±3% accuracy (LFOSC)
  • Data integrity
    • Cyclic redundancy checker (CRC-16 or CRC-32)
  • Flexible I/O features
    • Up to 28 GPIOs
    • Two 5-V-tolerant open-drain IOs with fail-safe protection
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 32-pin VQFN (RHB)
    • 32-pin VSSOP (DGS)
    • 28-pin VSSOP (DGS)
    • 24-pin VQFN (RGE)
    • 20-pin VSSOP (DGS)
    • 16-pin SOT(DYY)
  • Family members (also see Device Comparison)
    • MSPM0L1304: 16KB of flash, 2KB of RAM
    • MSPM0L1305: 32KB of flash, 4KB of RAM
    • MSPM0L1306: 64KB of flash, 4KB of RAM
  • Development kits and software (also see Tools and Software)
    • LP-MSPM0L1306 LaunchPad™ development kit
    • MSP Software Development Kit (SDK)

  • AEC-Q100 qualified for automotive applications

    • Temperature grade 1: –40°C to +125°C, TA

  • Functional Safety Quality-Managed
    • Documentation available to aid in functional safety system design
  • Core
    • Arm 32-bit Cortex-M0+ CPU, frequency up to 32 MHz
  • Operating characteristics
    • Wide supply voltage range: 1.62 V to 3.6 V
  • Memories
    • Up to 64KB of flash
    • Up to 4KB of SRAM
  • High-performance analog peripherals
    • One 12-bit 1.68-Msps analog-to-digital converter (ADC) with up to 10 total external channels
    • Configurable 1.4-V or 2.5-V internal ADC voltage reference (VREF)
    • Two zero-drift, zero-crossover chopper operational amplifiers (OPA)
      • 0.5-µV/°C drift with chopping
      • Integrated programmable gain stage (1-32x)
    • One general-purpose amplifier (GPAMP)
    • One high-speed comparator (COMP) with 8-bit reference DAC
      • 32-ns propagation delay
      • Low power mode down to <1-µA
    • Programmable analog connections between ADC, OPAs, COMP, and DAC
    • Integrated temperature sensor
  • Optimized low-power modes
    • RUN: 71 µA/MHz (CoreMark)
    • STOP: 151 µA at 4 MHz and 44 µA at 32 kHz
    • STANDBY: 1.0 µA with 32-kHz 16-bit timer running, SRAM/registers fully retained, and 32MHz clock wakeup in 3.2µs
    • SHUTDOWN: 61 nA with IO wakeup capability
  • Intelligent digital peripherals
    • 3-channel DMA controller
    • 3-channel event fabric signaling system
    • Four 16-bit general-purpose timers, each with two capture/compare registers supporting low-power operation in STANDBY mode, supporting a total of 8 PWM channels
    • Windowed watchdog timer
  • Enhanced communication interfaces
    • Two UART interfaces; one supporting LIN, IrDA, DALI, Smart Card, Manchester and both supporting low-power operation in STANDBY
    • Two I2C interfaces; one supporting FM+ (1 Mbit/s) and both supporting SMBus, PMBus, and wakeup from STOP
    • One SPI supporting up to 16 Mbit/s
  • Clock system
    • Internal 4- to 32-MHz oscillator with ±1.2% accuracy (SYSOSC)
    • Internal 32-kHz low-frequency oscillator with ±3% accuracy (LFOSC)
  • Data integrity
    • Cyclic redundancy checker (CRC-16 or CRC-32)
  • Flexible I/O features
    • Up to 28 GPIOs
    • Two 5-V-tolerant open-drain IOs with fail-safe protection
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 32-pin VQFN (RHB)
    • 32-pin VSSOP (DGS)
    • 28-pin VSSOP (DGS)
    • 24-pin VQFN (RGE)
    • 20-pin VSSOP (DGS)
    • 16-pin SOT(DYY)
  • Family members (also see Device Comparison)
    • MSPM0L1304: 16KB of flash, 2KB of RAM
    • MSPM0L1305: 32KB of flash, 4KB of RAM
    • MSPM0L1306: 64KB of flash, 4KB of RAM
  • Development kits and software (also see Tools and Software)
    • LP-MSPM0L1306 LaunchPad™ development kit
    • MSP Software Development Kit (SDK)

Description

MSPM0L130x microcontrollers (MCUs) are part of the MSP highly-integrated, ultra-low-power 32-bit MSPM0 MCU family based on the enhanced Arm Cortex-M0+ core platform operating at up to 32-MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 125°C, and operate with supply voltages ranging from 1.62 V to 3.6 V.

The MSPM0L130x devices provide up to 64KB embedded flash program memory with up to 4KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy up to ±1.2%, eliminating the need for an external crystal. Additional features include a 3-channel DMA, 16- and 32-bit CRC accelerator, and a variety of high-performance analog peripherals such as one 12-bit 1.68-MSPS ADC with configurable internal voltage reference, one high-speed comparator with built-in reference DAC, two zero-drift zero-crossover operational amplifiers with programmable gain, one general-purpose amplifier, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as four 16-bit general purpose timers, one windowed watchdog timer, and a variety of communication peripherals including two UARTs, one SPI, and two I2Cs. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, Smart Card, SMBus, and PMBus.

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration allowing for customers find the MCU that meets their project’s needs. The architecture combined with extensive low-power modes are optimized to achieve extended battery life in portable measurement applications.

MSPM0L130x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ development kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 L-Series 32-MHz Microcontrollers Technical Reference Manual.

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