Product
0
FF300R12KT3P_E
  • FF300R12KT3P_E

FF300R12KT3P_E

The half-bridge 62 mm 1200 V, 300 A Common Emitter IGBT module . This IGBT module is equipped with a fast TRENCHSTOP™ IGBT3, Emitter Controlled diode and pre-applied Thermal Interface Material . The 3-level phase leg configurations are possible in combination with a second 62 mm half-bridge module (e.g. FF300R12KT3 ).

Infineon Technologies FF300R12KT3P_E Product Info

16 April 2026 1

Parameters

Configuration

Common Emitter

Dimensions (width)

61.4 mm

Dimensions (length)

106.4 mm

Features

Phase leg, TIM

Housing

62 mm

IC(nom) / IF(nom)

300 A

IC max

300 A

Qualification

Industrial

Technology

IGBT3 - T3

VCE(sat) (Tvj=25°C typ)

1.7 V

VF (Tvj=25°C typ)

1.65 V

Voltage Class max

1200 V

Apps

Wind power, Motor control, Uninterruptible power supplies (UPS)

Features

  • Thermal interface mat. pre applied
  • UL/CSA certif. with UL1557 E83336
  • Op. temp. up to 125°C (max 150°C)
  • Optimized switching characteristics
  • RoHS compliant
  • RoHS compliant

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8