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CYW55572
  • CYW55572

CYW55572

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The AIROC™ CYW55572 is part of Infineon's Wi-Fi 6 and Bluetooth® 5.3 SoC family. The highly integrated solution supports dual-band Wi-Fi 6 (2.4G, 5G) 2x2 MIMO. It offers an exceptional video/audio streaming and seamless gaming experience in congested network environments and significantly boosts range and coverage, while also decreasing total Bill of Materials cost and board space.

Infineon Technologies CYW55572 Product Info

16 April 2026 0

Parameters

Antenna Configuration

2x2

Bluetooth Interface

UART/PCM/I2S

Bluetooth Specification

Bluetooth 6.0

Core

Cortex-M33

CPU

N/A

Dimensions

12 x 12 mm, 5.32 x 5.67 mm, 5.3 x 5.7 mm

Family

AIROC™ Wi-Fi + Bluetooth® Combos

GPIOs

15

Launch Date

2023

Longevity - 15 years

Yes

Longevity - Extended

No

Memory

N/A

Operating system support

Linux, Android

Operating Temperature range

-40 °C to 85 °C

Operating Voltage range

3 V to 4.8 V

Package

FCFBGA-289, WLCSP-486, WLBGA-225

Partner Module

Y

Pitch

0.65 mm, 0.2 mm, 0.35 mm

Planned to be available until at least

01-01-2038

Product Description

Wi-Fi 6 Combo

ROM

2048 KB

SRAM

512 kByte

Wi-Fi Band

2.4GHz, 5GHz

Wi-Fi Bandwidth

80 MHz

WI-FI Interface

SDIO/PCIe

Wi-Fi Specification

Wi-Fi 6 (802.11ax)

Apps

Smart speaker designs, Mobile robots (AGV, AMR), Security camera and video doorbell

Features

  • Wi-Fi 6, dual-band, 2x2 MIMO
  • 20/40/80 MHz, up to 1.2 Gbps PHY rate
  • OFDMA, MU-MIMO, TWT,DCM
  • Enhanced range, pwr & network efficiency
  • Multi-layer security protection
  • Smart coexistence
  • Temperature: -40°C to 85°C
  • Bluetooth® 5.3, Dual-mode operation
  • LE audio w/Auracast, LE- 2M, LR, Adv Ext
  • Bluetooth transmit at 20dbm/13dbm/0 dbm

Description

  • Performance beyond Wi-Fi 6/6e
  • Maximizes network efficiency
  • Extended edge AI+IoT device capabilities
  • High quality Bluetooth® LE audio
  • Multi-layer security protection
  • Accelerates time to market
  • Reduces development costs

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