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ADSD3030
  • ADSD3030
  • ADSD3030

ADSD3030

RECOMMENDED FOR NEW DESIGNS

VGA, CMOS, Time of Flight, Backside Illumination Sensor

Analog Devices ADSD3030 Product Info

10 February 2026 5

Features

  • 512 (horizontal) × 640 (vertical) pixel array
  • 3.5 μm × 3.5 μm square pixels
  • 1/6 inch optical format
  • 4-wire SPI or 2-wire I2C serial interface
  • MIPI CSI-2 transmitter interface with support for 1 or 2 data lanes, programmable up to 2.5 Gbps per lane
  • Dual, 3.3 V and 1.2 V external supplies, 1.8 V input and output section
  • Die size: 3.749 mm± 0.01 mm × 6.4544 mm ± 0.01 mm

Part details & applications

The ADSD3030 is a CMOS 3D Time of Flight (ToF)-based 3D depth and 2D visual light imager that is available for integration into 3D sensor systems. The functional blocks required for read out, which include analog-to-digital converters (ADCs), amplifiers, pixel biasing circuitry, and sensor control logic, are built into the chip to enable a cost-effective and simple implementation into systems.

The ADSD3030 interfaces electrically to a host system over a mobile industry processor interface (MIPI), Camera Serial Interface 2 (CSI-2) interface. A lens plus optical band-pass filter for the imager and an infrared light source plus an associated driver are required to complete the working subsystem.

APPLICATIONS

  • Smartphones
  • Augmented reality (AR) and virtual reality (VR)
  • Machine vision systems (logistics and inventory)
  • Robotics (consumer and industrial)

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