Product
0
TPSM8287B30
  • TPSM8287B30

TPSM8287B30

PREVIEW

6V, 30A parallelable DC/DC buck module with I2C, frequency synchronization and MagPack technology

Texas Instruments TPSM8287B30 Product Info

1 April 2026 2

Parameters

Rating

Catalog

Topology

Buck, Step-Down Converter, Synchronous Buck

Iout (max) (A)

30

Vin (max) (V)

6

Vin (min) (V)

2.7

Vout (max) (V)

1.675

Vout (min) (V)

0.4

Features

Adjustable soft start, Current Sharing, Differential Remote Sense, Differential Voltage sensing, EMI Tested, Enable, Frequency Dithering, Frequency synchronization, I2C control, I2C interface, I2C support, Light Load Efficiency, MagPack technology, Multiphase, Output discharge, Overcurrent protection, Phase Interleaving, Power good, Remote Sense, Spread-spectrum frequency dithering

EMI features

Integrated capacitors, Low parasitic Hotrod packaging, Spread Spectrum

Operating temperature range (°C)

-40 to 125

Type

Module

Duty cycle (max) (%)

75

Control mode

COT, Constant on-time (COT), DCS-Control

Switching frequency (min) (kHz)

1200

Switching frequency (max) (kHz)

1800

Package

QFN-FCMOD (VCH)-37-30 mm² 8 x 3.75

Features

  • ±0.8% output voltage accuracy
  • Differential remote sensing
  • Parallelable for multiphase operation
  • Start-up output voltage and I2C addresses selectable through VSETx pins:
    • 0.4V to 0.775V in 25mV steps
    • 0.8V to 1.55V in 50mV steps
  • Output voltage I2C adjustable in 1.25mV steps
  • Adjustable external compensation for wide output capacitor range and optimized transient response
  • Designed for low EMI requirements
    • MagPack technology shields inductor and IC
    • No bond wire package
    • Optional internal input and output capacitors
    • Simplified layout through parallel input path
    • Optional synchronization to external clock or spread-spectrum operation

  • Optional droop compensation through I2C

  • Power save mode or forced PWM operation
  • Precise enable input threshold
  • Power-good output with window comparator
  • Active output discharge
  • Excellent thermal performance
  • –40°C to 125°C operating temperature range
  • 3.75mm × 8.0mm QFN package with 0.5mm pitch
  • 66mm2 design size
  • ±0.8% output voltage accuracy
  • Differential remote sensing
  • Parallelable for multiphase operation
  • Start-up output voltage and I2C addresses selectable through VSETx pins:
    • 0.4V to 0.775V in 25mV steps
    • 0.8V to 1.55V in 50mV steps
  • Output voltage I2C adjustable in 1.25mV steps
  • Adjustable external compensation for wide output capacitor range and optimized transient response
  • Designed for low EMI requirements
    • MagPack technology shields inductor and IC
    • No bond wire package
    • Optional internal input and output capacitors
    • Simplified layout through parallel input path
    • Optional synchronization to external clock or spread-spectrum operation

  • Optional droop compensation through I2C

  • Power save mode or forced PWM operation
  • Precise enable input threshold
  • Power-good output with window comparator
  • Active output discharge
  • Excellent thermal performance
  • –40°C to 125°C operating temperature range
  • 3.75mm × 8.0mm QFN package with 0.5mm pitch
  • 66mm2 design size

Description

The TPSM8287Bxx is a family of pin-to-pin, step-down, DC/DC power modules with differential remote sensing and I2C interface. The power modules use TI’s MagPack technology to integrate a synchronous step-down converter, an inductor, input and output capacitors to simplify design, reduce external components and save PCB area. The low-profile and compact design is designed for assembly by standard surface mount equipment. The TPSM8287Bxx family implements an enhanced control scheme that supports fast transients. The TPSM8287Bxx can operate in fixed-frequency or power save mode. The remote sensing feature optimizes voltage regulation at the point-of-load and the device achieves ±0.8% DC voltage accuracy over the entire temperature range. The devices can operate in stacked, paralleled mode to deliver higher output currents or to spread the power dissipation across multiple devices. The I2C-compatible interface offers several control, monitoring, and warning features. The start-up voltage is selectable through the VSETx pins to allow a power-up without an active I2C communication.

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8