• High-Performance Static CMOS Technology
  • Up to 150 MHz for T_C = –55°C to 125°C
    and Up to 100 MHZ for T_C = 210°C
  • 1.9-V Core, 3.3-V I/O Design
• High-Performance 32-Bit CPU
  • IEEE-754 Single-Precision Floating-Point Unit (FPU))
  • 16 × 16 and 32 × 32 MAC Operations
  • 16 × 16 Dual MAC
  • Harvard Bus Architecture
  • Fast Interrupt Response and Processing
  • Unified Memory Programming Model
  • Code-Efficient (in C/C++ and Assembly)
• Six Channel DMA Controller (for ADC, McBSP,
  ePWM, XINTF, and SARAM)
• 16-bit or 32-bit External Interface (XINTF)
  • Over 2M × 16 Address Reach
• On-Chip Memory
  • 256K × 16 Flash, 34K × 16 SARAM
  • 1K × 16 OTP ROM
• Boot ROM (8K x 16)
  • With Software Boot Modes (via SCI, SPI, CAN,
    I2C, McBSP, XINTF, and Parallel I/O)
  • Standard Math Tables
• Clock and System Control
  • Dynamic PLL Ratio Changes Supported
  • On-Chip Oscillator
  • Watchdog Timer Module
• GPIO0 to GPIO63 Pins Can Be Connected to One
  of the Eight External Core Interrupts
• Peripheral Interrupt Expansion (PIE) Block
  That Supports All 58 Peripheral Interrupts
• 128-Bit Security Key/Lock
  • Protects Flash/OTP/RAM Blocks
  • Prevents Firmware Reverse Engineering
• Enhanced Control Peripherals
  • Up to 18 PWM Outputs
  • Up to 6 HRPWM Outputs With 150 ps MEP Resolution
  • Up to 6 Event Capture Inputs
  • Up to 2 Quadrature Encoder Interfaces
  • Up to 8 32-bit/Nine 16-bit Timers
• Three 32-Bit CPU Timers
• Serial Port Peripherals
  • Up to 2 CAN Modules
  • Up to 3 SCI (UART) Modules
  • Up to 2 McBSP Modules (Configurable as SPI)
  • One SPI Module
  • One Inter-Integrated-Circuit (I2C) Bus
• 12-Bit ADC, 16 Channels
  • 80-ns Conversion Rate
  • 2 × 8 Channel Input Multiplexer
  • Two Sample-and-Hold
  • Single/Simultaneous Conversions
  • Internal or External Reference
• Up to 88 Individually Programmable, Multiplexed
  GPIO Pins With Input Filtering
• JTAG Boundary Scan Support IEEE Standard 1149.1-1990
  Standard Test Access Port and Boundary Scan Architecture
• Advanced Emulation Features
  • Analysis and Breakpoint Functions
  • Real-Time Debug via Hardware
• Development Support Includes
  • ANSI C/C++ Compiler/Assembler/Linker
  • Code Composer Studio IDE
  • DSP/BIOS
  • Digital Motor Control and Digital Power
    Software Libraries
• Low-Power Modes and Power Savings
  • IDLE, STANDBY, HALT Modes Supported
  • Disable Individual Peripheral Clocks
• Package Option
  • Ceramic Pin Grid Array (GB)
  • HLQFP (PTP)
• Temperature Range:
  • GB Package: –55°C to 210°C (GB)
  • PTP Package: –55°C to 150°C (PTP)
• APPLICATIONS
  • Controlled Baseline
  • One Assembly/Test Site
  • One Fabrication Site
  • Available in Extreme (–55°C/210°C)
    Temperature Range⁽¹⁾
  • Extended Product Life Cycle
  • Extended Product-Change Notification
  • Product Traceability
  • Texas Instruments high temperature products utilize
    highly optimized silicon (die) solutions with design
    and process enhancements to maximize performance over
    extended temperatures.

⁽¹⁾ Custom temperature ranges available