Product
0
ESD122
  • ESD122
  • ESD122
  • ESD122

ESD122

ACTIVE

Dual 0.2-pF, ±3.6-V, ±17-kV ESD protection diode for USB Type-C and HDMI 2.0

Texas Instruments ESD122 Product Info

1 April 2026 3

Parameters

Number of channels

2

Vrwm (V)

3.6

Bi-/uni-directional

Bi-directional

Package name

DFN1006

Peak pulse power (8/20 μs) (max) (W)

20

IO capacitance (typ) (pF)

0.2

IEC 61000-4-2 contact (±V)

17000

IEC 61000-4-5 (A)

2.5

Clamping voltage (V)

13.5

Dynamic resistance (typ)

0.5

Interface type

HDMI 1.4, HDMI 2.0, MHL, SATA/PCIe, USB 2.0, USB 3.0, USB Type-C

Breakdown voltage (min) (V)

5

IO leakage current (max) (nA)

10

Rating

Catalog

Operating temperature range (°C)

-40 to 125

Package

X2SON (DMX)-3-0.6 mm² 1 x 0.6

Features

  • IEC 61000-4-2 Level 4 ESD Protection
    • ±17-kV Contact Discharge
    • ±17-kV Air Gap Discharge
  • Withstands over 10,000 ESD strikes per IEC 61000-4-2 Level 4 (Contact) without any performance degradation
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2.5 A (8/20 µs)
  • Low IO Capacitance
    • 0.1 pF (Typical) between IOs
    • 0.2 pF (Typical) IO to GND
  • DC Breakdown Voltage: 5.1 V (Minimum)
  • Ultra Low Leakage Current: 10 nA (Maximum)
  • Low ESD Clamping Voltage: 8.4 V at 5-A TLP
  • Supports High Speed Interfaces that exceed 10 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Type C Friendly Two Channel Flow-Through Routing Package
  • Pin-out to suit symmetric differential high-speed signal routing
  • Two Different Package Options
    • 0402 Package, 0.6 mm × 1 mm, 0.34-mm Pitch
    • 0502 Package, 0.6 mm × 1.32 mm, 0.5-mm Pitch
  • IEC 61000-4-2 Level 4 ESD Protection
    • ±17-kV Contact Discharge
    • ±17-kV Air Gap Discharge
  • Withstands over 10,000 ESD strikes per IEC 61000-4-2 Level 4 (Contact) without any performance degradation
  • IEC 61000-4-4 EFT Protection
    • 80 A (5/50 ns)
  • IEC 61000-4-5 Surge Protection
    • 2.5 A (8/20 µs)
  • Low IO Capacitance
    • 0.1 pF (Typical) between IOs
    • 0.2 pF (Typical) IO to GND
  • DC Breakdown Voltage: 5.1 V (Minimum)
  • Ultra Low Leakage Current: 10 nA (Maximum)
  • Low ESD Clamping Voltage: 8.4 V at 5-A TLP
  • Supports High Speed Interfaces that exceed 10 Gbps
  • Industrial Temperature Range: –40°C to +125°C
  • Type C Friendly Two Channel Flow-Through Routing Package
  • Pin-out to suit symmetric differential high-speed signal routing
  • Two Different Package Options
    • 0402 Package, 0.6 mm × 1 mm, 0.34-mm Pitch
    • 0502 Package, 0.6 mm × 1.32 mm, 0.5-mm Pitch

Description

The ESD122 is a bidirectional TVS ESD protection diode array for USB Type-C and HDMI 2.0 circuit protection. The ESD122 is rated to dissipate contact ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (17-kV Contact, 17-kV Air-gap).

This device features a low IO capacitance per channel and pin-out to suit symmetric differential high-speed signal routing making it ideal for protecting high-speed interfaces up to 10 Gbps such as USB 3.1 Gen2 and HDMI 2.0. The low dynamic resistance and low clamping voltage ensure system level protection against transient events.

Additionally, the ESD122 is an ideal ESD solution for the USB Type-C Tx/Rx lines. Since the USB Type-C connector has two layers, using 4-channel ESD devices require VIAs which degrade the signal integrity. Using four ESD122 (2-Ch) devices minimize the number of VIAs and simply the board layout.

The ESD122 is offered in two easy routing flow through packages.

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8