Product
0
CSD97394Q4M
  • CSD97394Q4M
  • CSD97394Q4M

CSD97394Q4M

ACTIVE

CSD97394Q4M Synchronous Buck NexFET™ Power Stage

Texas Instruments CSD97394Q4M Product Info

1 April 2026 4

Parameters

Rating

Catalog

VDS (V)

30

Ploss current (A)

12

Features

Ultra-low inductance package

Operating temperature range (°C)

-40 to 150

Package

VSON-CLIP (DPC)-8-15.75 mm² 4.5 x 3.5

Features

  • 90% System Efficiency at 15 A
  • Max Rated Continuous Current 20 A, Peak 45 A
  • High Frequency Operation (up to 2 MHz)
  • High Density – SON 3.5 × 4.5 mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3 V and 5 V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootsrap Diode
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free
  • 90% System Efficiency at 15 A
  • Max Rated Continuous Current 20 A, Peak 45 A
  • High Frequency Operation (up to 2 MHz)
  • High Density – SON 3.5 × 4.5 mm Footprint
  • Ultra-Low Inductance Package
  • System Optimized PCB Footprint
  • Ultra-Low Quiescent (ULQ) Current Mode
  • 3.3 V and 5 V PWM Signal Compatible
  • Diode Emulation Mode with FCCM
  • Input Voltages up to 24 V
  • Tri-State PWM Input
  • Integrated Bootsrap Diode
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating
  • Halogen Free

Description

The CSD97394Q4M NexFET™ Power Stage is a highly-optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables connected standby for Windows® 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5 mm outline package. In addition, the PCB footprint is optimized to help reduce design time and simplify the completion of the overall system design.

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8