Product
0
CC2745P10-Q1
  • CC2745P10-Q1
  • CC2745P10-Q1

CC2745P10-Q1

ACTIVE

Automotive SimpleLink™ Bluetooth® LE wireless MCU with 1MB flash, HSM, APU, CAN-FD, +20dBm

Texas Instruments CC2745P10-Q1 Product Info

1 April 2026 3

Parameters

Type

Wireless MCU

Technology

2.4 GHz, Bluetooth® LE

Protocols

Qualified against Bluetooth® Core 6.0

CPU

Arm® Cortex®-M33

Flash memory (kByte)

1024

RAM (kByte)

162

CAN (#)

CAN-FD

Number of GPIOs

23

TX power (max) (dBm)

20

Features

AEC-Q100 Grade 2 qualified, Channel Sounding, DC/DC, Integrated Algorithm Processing Unit (APU), Integrated RF switch, Integrated balun, LE 1M PHY, LE 2M PHY, LE Coded PHY (long range), OAD

Peripherals

1 Watchdog timer, 1 comparator, 12-bit ADC, 2 SPI, 2 UART, 4 timers, I2C, I2S, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC)

Security

Cryptographic acceleration, Hardware-enforced isolation, ISO21434 automotive cybersecurity compliant, Secure boot, Secure storage

Rating

Automotive

Operating temperature range (°C)

-40 to 125

Cryptographic accelerators

AES, ECC, RSA, SHA-2, TRNG

TI functional safety category

CS

Hardware accelerators

CDE NPU

Edge AI enabled

Yes

Package

VQFN (RHA)-40-36 mm² 6 x 6

Features

  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • Up to 1MB of in-system programmable flash
  • Up to 162KB of SRAM
  • 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • AEC-Q100 Grade 2 qualified:
    • –40°C to +125°C junction temperature
  • HBM ESD Classification Level 2 (ESD HBM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level C2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs with wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART with LIN capability
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • 1× CAN-FD controller with CAN/CAN-FD ISO 16845-1:2016 certification compliance
  • ISO21434 Automotive Cybersecurity Compliant
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.1mA
  • TX current at 0dBm: 7.7mA
  • TX current at +10dBm: 24.5mA (R variant)
  • TX current at +20dBm: 143mA (P variant)
  • Active mode MCU 96MHz (CoreMark): 6.8mA
  • Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160nA
  • Bluetooth® Core 6.0 Qualified
    • Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification
  • Output power up to +10dBm (R variant)
  • Output power up to +20dBm (P variant)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
  • LP-EM-CC2745R10-Q1, LP-EM-CC2755P10 LaunchPad™ Development Kit
  • BP-EM-CS Multiple antenna board for Bluetooth Channel Sounding
  • SimpleLink™ Low Power F3 Software Development Kit (SDK)
    • Fully qualified Bluetooth® software protocol stack in the SDK
      • Up to 32 concurrent multirole connections
      • Bluetooth Low Energy 6.0 Support
      • CCC Digital Key 3 / ICCE Bluetooth APIs support for secure car access systems
  • Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
  • SysConfig system configuration tool
  • SmartRF™ Studio for simple radio configuration

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • RoHS-compliant package

  • Arm Cortex-M33 processor (96MHz) with FPU (floating point unit), TrustZone-M support, and CDE (custom datapath extension) for machine learning acceleration
  • Algorithm Processing Unit (APU) (96MHz)
    • Mathematical accelerator for efficient vector and matrix operations
    • Bluetooth Channel Sounding post-processing support for IFFT and advanced super-resolution algorithms such as MUltiple SIgnal Classification (MUSIC)
  • Up to 1MB of in-system programmable flash
  • Up to 162KB of SRAM
  • 32KB of System ROM with secure boot root of trust (RoT) and a serial (SPI/UART) bootloader
  • Serial wire debug (SWD)
  • AEC-Q100 Grade 2 qualified:
    • –40°C to +125°C junction temperature
  • HBM ESD Classification Level 2 (ESD HBM level 1C on RF pin, per AEC-Q100 Rev. J)
  • CDM ESD Classification Level C2A (ESD CDM level C1 on RF pin, per AEC-Q100 Rev. J)
  • 23 GPIOs, digital peripherals can be routed to multiple GPIOs:
    • Two SWD IO pads, multiplexed with GPIOs
    • Two LFXT IO pads, multiplexed with GPIOs
    • 19 DIOs (analog or digital IOs)
  • All GPIOs with wakeup and interrupt capabilities
  • 3 × 16-bit and 1 × 32-bit general-purpose timers, quadrature decode mode support
  • Real-time clock (RTC)
  • Watchdog timer
  • System timer for radio, RTOS, and application operations for Bluetooth channel sounding postprocessing
  • 12-bit ADC, up to 1.2MSPS, eight external inputs
  • Temperature sensor and battery monitor
  • 1× low-power comparator
  • 2× UART with LIN capability
  • 2× SPI
  • 1× I2C
  • 1× I2S
  • 1× CAN-FD controller with CAN/CAN-FD ISO 16845-1:2016 certification compliance
  • ISO21434 Automotive Cybersecurity Compliant
  • Hardware Security Module (HSM) with proprietary controller and dedicated memories supporting accelerated cryptographic operations and secure key storage:
    • AES (up to 256 bits) crypto accelerator
    • ECC (up to 521 bits), RSA (up to 3072 bits) public key accelerator
    • SHA-2 (up to 512 bits) accelerator
    • True random number generator
    • HSM firmware update support
    • Differential power analysis (DPA) countermeasures for AES and ECC
  • Separate AES 128-bit cryptographic accelerator (LAES) for latency-critical link-layer operations
  • Secure boot and secure firmware updates
  • Cortex®-M33 TrustZone-M, MPU, memory firewalls for software isolation
  • Voltage glitch monitor (VGM)
  • On-chip buck DC/DC converter
  • RX current: 6.1mA
  • TX current at 0dBm: 7.7mA
  • TX current at +10dBm: 24.5mA (R variant)
  • TX current at +20dBm: 143mA (P variant)
  • Active mode MCU 96MHz (CoreMark): 6.8mA
  • Standby: 0.9µA (low power mode, RTC on, full SRAM retention)
  • Shutdown: 160nA
  • Bluetooth® Core 6.0 Qualified
    • Support for Bluetooth Channel Sounding (High Accuracy Distance Measurement)
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy specification
  • Output power up to +10dBm (R variant)
  • Output power up to +20dBm (P variant)
  • Integrated BALUN
  • Integrated RF switch
  • Receiver sensitivity:
    • Bluetooth LE 125kbps: –103.5dBm
    • Bluetooth LE 1Mbps: –97dBm

Regulatory compliance

  • Designed for systems targeting compliance with worldwide radio frequency regulations
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15 (US)
    • ARIB STD-T66 (Japan)
  • LP-EM-CC2745R10-Q1, LP-EM-CC2755P10 LaunchPad™ Development Kit
  • BP-EM-CS Multiple antenna board for Bluetooth Channel Sounding
  • SimpleLink™ Low Power F3 Software Development Kit (SDK)
    • Fully qualified Bluetooth® software protocol stack in the SDK
      • Up to 32 concurrent multirole connections
      • Bluetooth Low Energy 6.0 Support
      • CCC Digital Key 3 / ICCE Bluetooth APIs support for secure car access systems
  • Automotive SPICE (ASPICE) compliance for SDK components, including the Bluetooth LE stack
  • SysConfig system configuration tool
  • SmartRF™ Studio for simple radio configuration

Operating ranges

  • Junction temperature TJ: –40°C to 125°C
  • Wide supply voltage range 1.71V to 3.8V
Package
  • 6mm × 6mm QFN40 with wettable flanks
  • RoHS-compliant package

Description

The SimpleLink™ CC274xR-Q1 and CC274xP-Q1 devices are AEC-Q100 complaint wireless microcontrollers (MCUs) supporting Bluetooth Low Energy 6.0 for automotive applications. These devices are optimized for low-power wireless communication in applications such as car access, including passive entry passive start (PEPS), phone as a key (PaaK), and remote keyless entry (RKE). The key features of this device include:

  • Support for features in Bluetooth 6.0 and earlier versions:
    • LE Coded PHYs (Long Range), LE 2Mbit PHY (high speed), advertising extensions, multiple advertisement sets, CSA#2, as well as backward compatibility with earlier Bluetooth Low Energy specifications
  • Bluetooth Channel Sounding technology support and an Algorithm Processing Unit (APU) to enable high accuracy, low cost, and a secure phase-based ranging mechanism for distance estimation

    • APU enables latency and power-efficient execution of distance-ranging signal processing algorithms, including FFT, super-resolution complex algorithms like MUltiple SIgnal Classification (MUSIC), and neural network algorithms.

  • ArmCustom Data Extension (CDE) instruction support for machine learning acceleration
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 Software Development Kit (SDK)
  • Advanced security features for connected wireless MCUs:
    • An isolated HSM environment with a dedicated controller handling accelerated cryptographic and random number generation operations
    • Secure boot and firmware updates with the root of trust enabled by an immutable system ROM
    • Arm Cortex M33 TrustZone-M based trusted execution environment support
    • Secure key storage support with HSM and TrustZone-M
    • Hardware fault sensors to mitigate low-cost, low-effort, non-invasive physical attack threats like voltage glitch injection
    • Dedicated AES-128 HW accelerator for handling timing-critical link-layer encryption/decryption operations
  • Ultra-low standby current with full 162KB SRAM retention and RTC operation that enables significant battery life extension, especially for applications with longer sleep intervals
  • Extended temperature support with the lowest standby current
  • Integrated BALUN and integrated RF switch to support both transmit and receive operations on the same RF pin, even in the P version; thereby, enabling a reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy

The CC274xR/P-Q1 devices are part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich toolset. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

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