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FF900R12IE4P
  • FF900R12IE4P

FF900R12IE4P

Active and preferred

PrimePACK™ 2 1200 V, 900 A half-bridge dual IGBT module with TRENCHSTOP™ IGBT4, Emitter Controlled 4 Diode, NTC, fast switching chip and pre-applied Thermal Interface Material.

Infineon Technologies FF900R12IE4P Product Info

16 April 2026 0

Parameters

Configuration

half-bridge

Dimensions (length)

172 mm

Dimensions (width)

89 mm

Features

TIM

Housing

PrimePACK™ 2

IC(nom) / IF(nom)

900 A

IC max

900 A

Qualification

Industrial

Technology

IGBT4 - E4

VCE(sat) (Tvj=25°C typ)

1.75 V

VF (Tvj=25°C typ)

1.9 V

Voltage Class max

1200 V

Apps

Traction, Wind power, Motor control

Features

  • Extended operation temp. Tvj op
  • High DC stability
  • High short circuit capability
  • Low switching losses
  • Unbeatable robustness
  • VCEsatwith positive temp. coeffici.
  • 4 kV AC 1 min insulation
  • Package with CTI > 400
  • High creepage & clearance distances
  • High power & thermal cycling capab.
  • Substrate for low therm. resistance
  • UL recognized

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