0
FF1MR12KM1HP
  • FF1MR12KM1HP

FF1MR12KM1HP

Active and preferred

62 mm CoolSiC™ MOSFET half-bridge module 1200 V, 1.6 mΩ G1 in the well known 62mm housing combined with M1H chip technology and pre-applied Thermal Interface Material (TIM).

Infineon Technologies FF1MR12KM1HP Product Info

16 April 2026 0

Parameters

Applications

UPS, ESS, Solar, EV Charger

Configuration

Half-bridge

Dimensions (length)

106.4 mm

Dimensions (width)

61.4 mm

Features

TIM

Housing

62 mm

Qualification

Industrial

RDS (on) (@ Tj = 25°C)

1.5 mΩ

Apps

Battery energy storage (BESS), EV charging, Photovoltaic, Uninterruptible power supplies (UPS)

Features

  • High current density
  • Low switching losses
  • Superior gate oxide reliability
  • Highest robustness against humidity
  • Robust integrated body diode
  • High cosmic ray robustness
  • High speed switching module
  • Symmetrical module design
  • Standard construction technique

Description

  • Minimizes cooling efforts
  • Reduction in volume and size
  • Reduced system costs

Subscribe to Welllinkchips !
Your Name
* Email
Submit a request