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OUTLINE
  • Introduction

  • The Sigma-Delta Core: Why Converter Architecture Defines This Part

  • Memory and Processing: Right-Sized for Focused Firmware

  • Pin Allocation and System Integration on 36 I/O

  • Application Envelope and Development Entry

STM32F373C8T6 — Precision Sigma-Delta Sensing at the Entry Point of the F373 Line

21 October 2026     By Ryan 0

Introduction

 

The STM32F373C8T6 occupies a deliberate position in ST’s mixed-signal portfolio: it is the least expensive way to access the F373 family’s triple 16-bit Sigma-Delta ADC architecture while retaining the full Cortex-M4F processing core and a broad communication peripheral set. Packaged in a 48-pin LQFP measuring 7 mm × 7 mm, it pairs 64 KB of Flash and 16 KB of SRAM with 36 general-purpose I/O pins. For designs where the analog fidelity of the SDADC matters more than large code storage or high I/O count, the C8T6 delivers the essential mixed-signal capability without the cost of memory the application will never use.

 

The Sigma-Delta Core: Why Converter Architecture Defines This Part

 

The defining engineering decision behind the STM32F373C8T6 is its analog conversion strategy. Rather than relying solely on a fast SAR ADC, the device integrates three independent 16-bit Sigma-Delta ADCs alongside a 12-bit SAR ADC, three 12-bit DAC channels, and two rail-to-rail comparators. The SDADC uses oversampling and noise shaping: the modulator samples at a high rate, and a programmable digital decimation filter removes out-of-band quantization noise, producing high effective resolution for signals with modest bandwidth. This architecture is inherently well suited to low-frequency precision measurements—temperature, pressure, strain, and biopotential signals—where the SDADC’s linearity and noise performance exceed what a SAR converter of similar nominal resolution can achieve without extensive external filtering.

 

On the C8T6, the SDADCs operate from a dedicated analog supply spanning 2.2 V to 3.6 V, isolating them from digital switching noise on the core rail. Up to 21 single-ended or 11 differential channels are available across the three converters, and the digital filter is programmable, allowing the output data rate to be traded against resolution. The three SDADCs can be triggered synchronously, which is essential for coherent multi-channel measurements in bridge-sensor or three-phase sensing configurations.

 

The supporting analog infrastructure is equally consequential. The 12-bit SAR ADC converts in 1.0 μs and handles faster auxiliary monitoring, keeping the SDADCs dedicated to precision channels. The three 12-bit DAC outputs can provide sensor excitation or offset compensation, and the two comparators enable hardware-level threshold detection without firmware polling. ST’s application note AN4207 demonstrates the SDADC in PT100 temperature measurement, MPX2102A pressure sensing, wave recording, and ECG acquisition, providing validated reference designs for each of these use cases.

 

Memory and Processing: Right-Sized for Focused Firmware

 

The 64 KB Flash / 16 KB SRAM configuration of the C8T6 is the smallest memory footprint in the 48-pin F373 lineup. This is not a limitation for its intended role: a sensor-interface application that configures the SDADCs, runs a linearization or filtering routine, and communicates over a serial bus or USB device interface typically resides well within this budget. The Cortex-M4F core at 72 MHz delivers 1.25 DMIPS/MHz with single-cycle multiplication, hardware division, and DSP instructions, so the floating-point math required for sensor compensation and digital filtering executes efficiently without software emulation.

 

A 12-channel DMA controller is available to move SDADC results and communication payloads into SRAM without CPU intervention, which is particularly valuable when the core is occupied with filter computations or protocol handling. The 16 KB SRAM supports double-buffered acquisition strategies for a subset of channels; designs that require simultaneous high-rate acquisition across all three SDADCs while running a USB stack will need to budget memory carefully, but for single-purpose sensing nodes the allocation is comfortable.

 

Table summarizes the C8T6’s resource envelope in the context of its immediate 48-pin siblings.

Parameter

STM32F373C8T6

STM32F373CBT6 (reference)

STM32F373CCT6 (reference)

Flash / SRAM

64 KB / 16 KB

128 KB / 24 KB

256 KB / 32 KB

Package / I/O

LQFP48 / 36

LQFP48 / 36

LQFP48 / 36

SDADC

3 × 16-bit

3 × 16-bit

3 × 16-bit

12-bit SAR ADC

1 × 1.0 μs

1 × 1.0 μs

1 × 1.0 μs

DAC

3 × 12-bit

3 × 12-bit

3 × 12-bit

5 V-tolerant I/O

Yes, up to 45 on larger packages

Yes

Yes

 

The table makes the C8T6’s positioning explicit: every analog resource of the F373 architecture is present, and the differentiation is confined to memory capacity. This means a design that prototypes on the C8T6 can migrate to the CBT6 or CCT6 without changing the analog front-end or the SDADC configuration code.

 

Pin Allocation and System Integration on 36 I/O

 

The 36 I/O available on the LQFP48 package require disciplined peripheral partitioning. A representative precision-sensing configuration might allocate two SDADC differential pairs to a bridge sensor, one SDADC channel to a temperature-compensation input, two SAR ADC channels to supply-rail monitoring, one USART for host communication, one I²C bus for a local sensor hub, and several PWM outputs from the 16-bit timers for heater or valve control. The 5 V-tolerant capability on many pins simplifies direct interface to industrial sensors and legacy logic without external level shifting.

 

The communication peripheral set is broad for this class: CAN 2.0B Active, USB 2.0 full-speed device, three USARTs (with LIN, IrDA, ISO/IEC 7816, and auto-baud support), three SPIs with muxed I²S, two Fast Mode Plus I²Cs, and an HDMI-CEC interface. Not every interface can be active simultaneously on 36 pins, but the breadth allows the C8T6 to serve as a protocol bridge between a precision analog sensor front-end and a CAN or USB host link.

 

Application Envelope and Development Entry

 

The STM32F373C8T6 is best matched to applications where a small number of precision analog channels must be acquired with high linearity and communicated reliably, and where code size and I/O count are predictable. Loop-powered industrial transmitters—pressure, temperature, or flow—are a natural fit: the SDADC handles the sensor bridge, the DAC drives the 4–20 mA loop, and the USART or CAN interface carries configuration and diagnostic data. Compact environmental monitors and portable medical peripherals that acquire low-bandwidth biopotential or impedance signals also align with the device’s strengths. In these roles, the 64 KB Flash budget accommodates calibration tables, linearization polynomials, and a lightweight communication stack without requiring external non-volatile memory.

 

Development follows the standard STM32CubeF3 path. The HAL SDADC driver provides initialization, channel configuration, calibration, and filter setup; ST’s GitHub repository includes a complete SDADC voltmeter example that realizes pressure measurement using the MPX2102A sensor, providing a concrete starting point for precision acquisition firmware. The STM32CubeIDE toolchain, with GCC and ST-LINK debug support, covers the full development cycle at no cost. For teams that anticipate future code growth, the shared LQFP48 pinout across the C8, CB, and CC variants means a single PCB can be populated with the C8T6 for initial production and upgraded to a larger-memory variant later without layout changes—a pragmatic path for products whose feature set may expand after launch.

 



About Ryan

Ryan is an Electronic Engineer at Welllinkchips with 12+ years of industry experience. He writes clear, practical resources that help engineering and procurement teams evaluate component specifications, circuit performance, reliability, lifecycle risk, and supplier considerations.

His work is intended to support informed design and purchasing decisions for active, obsolete, and hard-to-source electronic components.

Areas of focus

· Electronic circuit design and component selection

· Obsolete and end-of-life component risk

· Supplier verification and counterfeit-risk reduction

· Component alternatives and BOM continuity

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