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MAX20766
  • MAX20766

MAX20766

PRODUCTION

Smart Slave IC with Integrated Current and Temperature Sensors Smart Slave IC with Integrated Current and Temperature Sensors

Analog Devices MAX20766 Product Info

10 February 2026 11

Features

  • Increased Power Density with Fewer External Components
    • Monolithic Integration for Reduced Parasitics
    • Scalable Architecture Compatible with Coupled Inductors
    • 94% Peak Efficiency
    • Top-Side Cooling for Improved Heat Transfer to Ambient
  • Accurate Real-Time Telemetry of Critical Parameters
    • PMBus-Compliant Interface through the Controller IC for Telemetry and Power Management
    • Junction Temperature Monitoring and Reporting
    • Per-Phase Current Reporting
  • Advanced Self-Protection Features for the System and IC
    • Overcurrent Protection
    • Overtemperature Protection
    • Boost Voltage UVLO
    • VX Short Protection
    • ,

Part details & applications

The MAX20766 is a feature-rich smart slave IC designed to work with Maxim’s seventh-generation controller to implement a high-density multiphase voltage regulator. Up to six smart slave ICs, plus a controller IC, provide a compact synchronous buck converter that includes accurate individual phase-current and temperature reporting through SMBus/PMBus™. This smart slave device includes protection circuits for overtemperature, VX short, and all power-supply UVLO faults. If a fault is detected, the slave IC immediately shuts down and sends a fault signal to the controller IC.

Monolithic integration and advanced packaging technologies allow practical per-phase, high-switching frequencies with significantly lower losses than alternative implementations. Smart slave ICs are designed to support phase shedding and DCM modes for efficiency optimization over a wide range of load currents. High per-phase current- capability designs with low COUT enable a design with fewer phases and a smaller footprint.

The MAX20766 is available in a 16-pin FCQFN package with exposed top-side thermal pads. Top-side cooling improves heat transfer to ambient and reduces PCB and component temperatures.

Applications

  • Communication and Networking Equipment
  • FPGAs
  • High-Current Voltage Regulators
  • Memory
  • Microprocessor Chipsets
  • Networking ASICs
  • Servers and Storage Equipment

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