- General
- Integrates RF, power amplifiers (PAs), clocks, RF switches, filters, passives, and power management
- Quick hardware design with TI module collateral and reference designs
- Operating temperature: –40°C to +85°C industrial temperature grade
- Small form factor: 13.3mm × 13.4mm × 2mm
- 100-pin MOC package
- FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
- Wi-Fi
- WLAN baseband processor and RF transceiver support of IEEE Std 802.11a, 802.11b, 802.11g, and 802.11n
- 20MHz and 40MHz SISO and 20MHz 2 × 2 MIMO at 2.4GHz for high throughput: 80Mbps (TCP), 100Mbps (UDP)
- 2.4GHz MRC support for extended range and 5GHz diversity capable
- Fully calibrated: Production calibration is not required
- 4-bit SDIO host interface support
- Wi-Fi direct concurrent operation (multichannel, multirole)
- Bluetooth and Bluetooth Low Energy: WL1837MOD only
- Bluetooth 5.1 secure connection compliant and CSA2 support; declaration ID: D052427
- Host controller interface (HCI) transport for Bluetooth over UART
- Dedicated audio processor support of SBC encoding + A2DP
- Dual-mode Bluetooth and Bluetooth Low Energy
- TI’s Bluetooth and Bluetooth Low Energy certified stack
- Key benefits
- Reduces design overhead
- Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
- Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
- Different provisioning methods for in-home devices’ connectivity to Wi-Fi in one step
- Lowest Wi-Fi power consumption in connected idle (< 800µA)
- Configurable wake on WLAN filters to only wake up the system
- Wi-Fi and Bluetooth single antenna coexistence
- General
- Integrates RF, power amplifiers (PAs), clocks, RF switches, filters, passives, and power management
- Quick hardware design with TI module collateral and reference designs
- Operating temperature: –40°C to +85°C industrial temperature grade
- Small form factor: 13.3mm × 13.4mm × 2mm
- 100-pin MOC package
- FCC, IC, ETSI/CE, and TELEC certified with PCB, dipole, chip, and PIFA antennas
- Wi-Fi
- WLAN baseband processor and RF transceiver support of IEEE Std 802.11a, 802.11b, 802.11g, and 802.11n
- 20MHz and 40MHz SISO and 20MHz 2 × 2 MIMO at 2.4GHz for high throughput: 80Mbps (TCP), 100Mbps (UDP)
- 2.4GHz MRC support for extended range and 5GHz diversity capable
- Fully calibrated: Production calibration is not required
- 4-bit SDIO host interface support
- Wi-Fi direct concurrent operation (multichannel, multirole)
- Bluetooth and Bluetooth Low Energy: WL1837MOD only
- Bluetooth 5.1 secure connection compliant and CSA2 support; declaration ID: D052427
- Host controller interface (HCI) transport for Bluetooth over UART
- Dedicated audio processor support of SBC encoding + A2DP
- Dual-mode Bluetooth and Bluetooth Low Energy
- TI’s Bluetooth and Bluetooth Low Energy certified stack
- Key benefits
- Reduces design overhead
- Differentiated use cases by configuring WiLink™ 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channel (Wi-Fi networks)
- Best-in-class Wi-Fi with high-performance audio and video streaming reference applications with up to 1.4× the range versus one antenna
- Different provisioning methods for in-home devices’ connectivity to Wi-Fi in one step
- Lowest Wi-Fi power consumption in connected idle (< 800µA)
- Configurable wake on WLAN filters to only wake up the system
- Wi-Fi and Bluetooth single antenna coexistence
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ACTIVE
