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UCC21222
  • UCC21222
  • UCC21222

UCC21222

ACTIVE

3.0kVrms 4A/6A dual-channel isolated gate driver with disable pin, programmable deadtime & 8V UVLO

Texas Instruments UCC21222 Product Info

1 April 2026 1

Parameters

Number of channels

2

Isolation rating

Basic

Power switch

GaNFET, IGBT, MOSFET

Withstand isolation voltage (VISO) (Vrms)

3000

Working isolation voltage (VIOWM) (Vrms)

990

Transient isolation voltage (VIOTM) (VPK)

4242

Peak output current (A)

6

Peak output current (source) (typ) (A)

4

Peak output current (sink) (typ) (A)

6

Features

Disable, Programmable dead time

Output VCC/VDD (min) (V)

9.2

Output VCC/VDD (max) (V)

18

Input supply voltage (min) (V)

3

Input supply voltage (max) (V)

5.5

Propagation delay time (µs)

0.028

Input threshold

CMOS, TTL

Operating temperature range (°C)

-40 to 125

Rating

Catalog

Rise time (ns)

5

Fall time (ns)

6

Undervoltage lockout (typ) (V)

8

Package

SOIC (D)-16-59.4 mm² 9.9 x 6

Features

  • Universal: dual low-side, dual high-side or halfbridge driver

  • Junction temperature range –40 to +150°C
  • Up to 4A peak source and 6A peak sink output
  • Common-mode transient immunity (CMTI) greater than 125V/ns
  • Up to 25V VDD output drive supply
    • 8V, VDD UVLO options
  • Switching parameters:
    • 33ns typical propagation delay
    • 5ns maximum pulse-width distortion
    • 10µs maximum VDD power-up delay
  • UVLO protection for all power supplies
  • Fast disable for power sequencing
  • Safety-related certifications (planned):
    • 4242VPK isolation per DIN EN IEC 60747-17 (VDE 0884-17)
    • 3000VRMS isolation for 1 minute per UL 1577
    • CQC Certification per GB4943.1-2022
  • Universal: dual low-side, dual high-side or halfbridge driver

  • Junction temperature range –40 to +150°C
  • Up to 4A peak source and 6A peak sink output
  • Common-mode transient immunity (CMTI) greater than 125V/ns
  • Up to 25V VDD output drive supply
    • 8V, VDD UVLO options
  • Switching parameters:
    • 33ns typical propagation delay
    • 5ns maximum pulse-width distortion
    • 10µs maximum VDD power-up delay
  • UVLO protection for all power supplies
  • Fast disable for power sequencing
  • Safety-related certifications (planned):
    • 4242VPK isolation per DIN EN IEC 60747-17 (VDE 0884-17)
    • 3000VRMS isolation for 1 minute per UL 1577
    • CQC Certification per GB4943.1-2022

Description

The UCC21222 is an isolated dual channel gate driver family with programmable dead time and wide temperature range. It is designed with 4A peak-source and 6A peak-sink current to drive power MOSFET, SiC, GaN, and IGBT transistors.

The UCC21222 can be configured as two low-side drivers, two high-side drivers, or a half-bridge driver. The input side is isolated from the two output drivers by a 3kVRMS isolation barrier, with a minimum of 125V/ns common-mode transient immunity (CMTI).

Protection features include: resistor programmable dead time, disable feature to shut down both outputs simultaneously, and integrated de-glitch filter that rejects input transients shorter than 5ns. All supplies have UVLO protection.

With all these advanced features, the UCC21222 device enables high efficiency, high power density, and robustness in a wide variety of power applications.

The UCC21222 is an isolated dual channel gate driver family with programmable dead time and wide temperature range. It is designed with 4A peak-source and 6A peak-sink current to drive power MOSFET, SiC, GaN, and IGBT transistors.

The UCC21222 can be configured as two low-side drivers, two high-side drivers, or a half-bridge driver. The input side is isolated from the two output drivers by a 3kVRMS isolation barrier, with a minimum of 125V/ns common-mode transient immunity (CMTI).

Protection features include: resistor programmable dead time, disable feature to shut down both outputs simultaneously, and integrated de-glitch filter that rejects input transients shorter than 5ns. All supplies have UVLO protection.

With all these advanced features, the UCC21222 device enables high efficiency, high power density, and robustness in a wide variety of power applications.

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