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TX73L64
  • TX73L64
  • TX73L64

TX73L64

ACTIVE

64-channel, 3-level, 1A pulser with integrated transmit beamformer and low noise amplifier

Texas Instruments TX73L64 Product Info

1 April 2026 0

Parameters

Device type

Transmitter

Number of input channels

64

Active supply current (typ) (mA)

20

Supply voltage (max) (V)

5.5

Operating temperature range (°C)

0 to 70

Interface type

LVDS/Serial

Rating

Catalog

Package

FCCSP (ACP)-196-144 mm² 12 x 12

Features

  • Transmitter supports:
    • 64-channel 3-level pulser and active transmit/ receive (T/R) switch
  • 3-level pulser:
    • Maximum output voltage: ±100V
    • Minimum output voltage: ±1V
    • Maximum output current: 1A
    • True return to zero to discharge output to ground
    • Second harmonic of –40dBc at 5MHz
    • –3-dB Bandwidth with 400Ω || 125pF load
      • 22MHz for a ±100-V supply
    • Very low receive power: 2.8mW/ch
  • Active transmit/receive (T/R) switch with:
    • Turn on resistance of 22Ω
    • Turn on and Turn off time: 100ns
    • 2:1 Channel Muxing to LNA input
  • LNA
    • Supports a maximum input swing of 500mVpp
    • Gain of 24dB
    • HD2 of -55 dBc and HD3 of 40dBc at 5MHz
    • Programmable input impedance to match source impedance 100, 200. 400 and 800Ω with DTGC support
  • On-chip beam former with:
    • Channel based T/R switch on and off controls
    • Delay resolution: half beamformer clock period, minimum 2.5ns
    • Maximum delay: 214 beamformer clock period
    • Maximum beamformer clockspeed: 200MHz
    • On-Chip RAM for pattern and delay profile
    • One 512 × 32 memory to store beam-former pattern and delay for a group of 4 channels
    • Global repeat feature present, enabling long duration patterns
  • High-speed (400MHz maximum), 2-lane LVDS serial programming interface.
    • Low programming time: ≈1µs for delay profile update
    • 32-bit Checksum to detect wrong SPI writes
  • Supports CMOS serial programming interface (50MHz maximum)
  • High reliability features:
    • Internal temperature sensor and automatic thermal shutdown
    • No specific power sequencing requirement
    • Error flag register to detect faulty conditions
    • Integrated passives for the floating supplies and bias voltages
    • Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch
  • Transmitter supports:
    • 64-channel 3-level pulser and active transmit/ receive (T/R) switch
  • 3-level pulser:
    • Maximum output voltage: ±100V
    • Minimum output voltage: ±1V
    • Maximum output current: 1A
    • True return to zero to discharge output to ground
    • Second harmonic of –40dBc at 5MHz
    • –3-dB Bandwidth with 400Ω || 125pF load
      • 22MHz for a ±100-V supply
    • Very low receive power: 2.8mW/ch
  • Active transmit/receive (T/R) switch with:
    • Turn on resistance of 22Ω
    • Turn on and Turn off time: 100ns
    • 2:1 Channel Muxing to LNA input
  • LNA
    • Supports a maximum input swing of 500mVpp
    • Gain of 24dB
    • HD2 of -55 dBc and HD3 of 40dBc at 5MHz
    • Programmable input impedance to match source impedance 100, 200. 400 and 800Ω with DTGC support
  • On-chip beam former with:
    • Channel based T/R switch on and off controls
    • Delay resolution: half beamformer clock period, minimum 2.5ns
    • Maximum delay: 214 beamformer clock period
    • Maximum beamformer clockspeed: 200MHz
    • On-Chip RAM for pattern and delay profile
    • One 512 × 32 memory to store beam-former pattern and delay for a group of 4 channels
    • Global repeat feature present, enabling long duration patterns
  • High-speed (400MHz maximum), 2-lane LVDS serial programming interface.
    • Low programming time: ≈1µs for delay profile update
    • 32-bit Checksum to detect wrong SPI writes
  • Supports CMOS serial programming interface (50MHz maximum)
  • High reliability features:
    • Internal temperature sensor and automatic thermal shutdown
    • No specific power sequencing requirement
    • Error flag register to detect faulty conditions
    • Integrated passives for the floating supplies and bias voltages
    • Small package: FC-BGA-196 (12mm × 12mm) with 0.8mm pitch

Description

TX73L64 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has total 64 pulser circuits, 64 transmit/ receive switches (referred as T/R or TR switches), 32 LNA circuits, and supports on-chip beamformer (TxBF). The T/R switches also perform a 2:1 multiplexing operation to multiplex inputs of 2 channels to 1 LNA. The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

TX73L64 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 64 outputs. The maximum output current is 1A.

Device can be used as a transmitter device for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.

TX73L64 is a highly integrated, high-performance transmitter device for ultrasound imaging system. The device has total 64 pulser circuits, 64 transmit/ receive switches (referred as T/R or TR switches), 32 LNA circuits, and supports on-chip beamformer (TxBF). The T/R switches also perform a 2:1 multiplexing operation to multiplex inputs of 2 channels to 1 LNA. The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

TX73L64 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that is used to excite multiple channels of an ultrasound transducer. The device supports total 64 outputs. The maximum output current is 1A.

Device can be used as a transmitter device for many applications like ultrasound imaging, non-destructive testing, SONAR, LIDAR, marine navigation system, brain imaging systems and so on.

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