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TS3L100
  • TS3L100
  • TS3L100
  • TS3L100
  • TS3L100
  • TS3L100

TS3L100

ACTIVE

3.3-V, 2:1 (SPDT), 4-channel LAN switch

Texas Instruments TS3L100 Product Info

1 April 2026 1

Parameters

Protocols

10 BASE-T, 100 BASE-T, LAN

Configuration

2:1 SPDT

Number of channels

4

Bandwidth (MHz)

350

Supply voltage (max) (V)

3.6

Supply voltage (min) (V)

3

Ron (typ) (mΩ)

10000

Input/output voltage (min) (V)

0

Input/output voltage (max) (V)

3.6

Supply current (typ) (µA)

0.1

ESD HBM (typ) (kV)

2

Operating temperature range (°C)

0 to 70

Crosstalk (dB)

-68

ESD CDM (kV)

1

Input/output continuous current (max) (mA)

128

COFF (typ) (pF)

10

CON (typ) (pF)

3

Off isolation (typ) (dB)

-42

OFF-state leakage current (max) (µA)

1

Propagation delay time (µs)

0.0075

Ron (max) (mΩ)

15000

Ron channel match (max) (Ω)

1

RON flatness (typ) (Ω)

1

Turnoff time (disable) (max) (ns)

3.5

Turnon time (enable) (max) (ns)

7.5

VIH (min) (V)

2

VIL (max) (V)

0.8

Rating

Catalog

Package

SOIC (D)-16-59.4 mm² 9.9 x 6

Features

  • Wide Bandwidth (BW = 350 MHz Min)
  • Low Differential Crosstalk (XTALK = –68 dB Typ)
  • Low Power Consumption (ICC = 10 µA Max)
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron = 5 Typ)
  • Rail-to-Rail Switching on Data I/O Ports (0 to VCC)
  • VCC Operating Range From 3 V to 3.6 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Have Undershoot Clamp Diodes
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both 10 Base-T/100 Base-T Signaling

  • Wide Bandwidth (BW = 350 MHz Min)
  • Low Differential Crosstalk (XTALK = –68 dB Typ)
  • Low Power Consumption (ICC = 10 µA Max)
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron = 5 Typ)
  • Rail-to-Rail Switching on Data I/O Ports (0 to VCC)
  • VCC Operating Range From 3 V to 3.6 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Have Undershoot Clamp Diodes
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both 10 Base-T/100 Base-T Signaling

Description

The TI TS3L100 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E) input. When E is low, the switch is enabled and the I port is connected to the Y port. When E is high, the switch is disabled and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer.

This device can be used to replace mechanical relays in LAN applications. This device has low ron, wide bandwidth, and low differential crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN applications.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, E should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The TI TS3L100 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E) input. When E is low, the switch is enabled and the I port is connected to the Y port. When E is high, the switch is disabled and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer.

This device can be used to replace mechanical relays in LAN applications. This device has low ron, wide bandwidth, and low differential crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN applications.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, E should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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