Product
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TMS320F2810-Q1
  • TMS320F2810-Q1
  • TMS320F2810-Q1

TMS320F2810-Q1

ACTIVE

Automotive C2000™ 32-bit MCU with 150 MHz, 128 KB flash

Texas Instruments TMS320F2810-Q1 Product Info

1 April 2026 0

Parameters

CPU

1 C28

Frequency (MHz)

150

Flash memory (kByte)

128

RAM (kByte)

36

ADC type

12-bit

Total processing (MIPS)

150

Features

2-pin oscillator, 32-bit CPU timers, External memory interface, McBSP, Watchdog timer

UART

2

CAN (#)

1

Sigma-delta filter

0

PWM (Ch)

16

Number of ADC channels

16

Direct memory access (Ch)

0

SPI

1

QEP

2

USB

No

Operating temperature range (°C)

-40 to 125

Rating

Automotive

Communication interface

CAN, McBSP, SPI, UART

Operating system

FreeRTOS

Nonvolatile memory (kByte)

128

Number of GPIOs

56

Number of I2Cs

0

Security

Secure storage

Edge AI enabled

No

Package

LQFP (PBK)-128-256 mm² 16 x 16

Features

  • High-performance static CMOS technology
    • 150 MHz (6.67-ns cycle time)
    • Low-power (1.8-V core at 135 MHz, 1.9-V core at 150 MHz, 3.3-V I/O) design
  • JTAG boundary scan support
    • IEEE Standard 1149.1-1990 IEEE Standard Test Access Port and Boundary-Scan Architecture
  • High-performance 32-bit CPU (TMS320C28x)
    • 16 × 16 and 32 × 32 MAC operations
    • 16 × 16 dual MAC
    • Harvard bus architecture
    • Atomic operations
    • Fast interrupt response and processing
    • Unified memory programming model
    • 4M linear program/data address reach
    • Code-efficient (in C/C++ and Assembly)
    • TMS320F24x/LF240x processor source code compatible
  • On-chip memory
    • Up to 128K × 16 flash (Four 8K × 16 and six 16K × 16 sectors)
    • 1K × 16 OTP ROM
    • L0 and L1: 2 blocks of 4K × 16 each Single-Access RAM (SARAM)
    • H0: 1 block of 8K × 16 SARAM
    • M0 and M1: 2 blocks of 1K × 16 each SARAM
  • Boot ROM (4K × 16)
    • With software boot modes
    • Standard math tables
  • External interface (F2812)
    • Over 1M × 16 total memory
    • Programmable wait states
    • Programmable read/write strobe timing
    • Three individual chip selects
  • Endianness: Little endian
  • Clock and system control
    • On-chip oscillator
    • Watchdog timer module
  • Three external interrupts
  • Peripheral Interrupt Expansion (PIE) block that supports 45 peripheral interrupts
  • Three 32-bit CPU timers
  • 128-bit security key/lock
    • Protects flash/OTP and L0/L1 SARAM
    • Prevents firmware reverse-engineering
  • Motor control peripherals
    • Two Event Managers (EVA, EVB)
    • Compatible to 240xA devices
  • Serial port peripherals
    • Serial Peripheral Interface (SPI)
    • Two Serial Communications Interfaces (SCIs), standard UART
    • Enhanced Controller Area Network (eCAN)
    • Multichannel Buffered Serial Port (McBSP)
  • 12-bit ADC, 16 channels
    • 2 × 8 channel input multiplexer
    • Two Sample-and-Hold
    • Single/simultaneous conversions
    • Fast conversion rate: 80 ns/12.5 MSPS
  • Up to 56 General-Purpose I/O (GPIO) pins
  • Advanced emulation features
    • Analysis and breakpoint functions
    • Real-time debug via hardware
  • Development tools include
    • ANSI C/C++ compiler/assembler/linker
    • Code Composer Studio™ IDE
    • DSP/BIOS™
    • JTAG scan controllers
      • IEEE Standard 1149.1-1990 IEEE Standard Test Access Port and Boundary-Scan Architecture
  • Low-power modes and power savings
    • IDLE, STANDBY, HALT modes supported
    • Disable individual peripheral clocks
  • Package options
    • 179-ball MicroStar BGA™ with external memory interface (GHH, ZHH) (F2812)
    • 176-pin Low-Profile Quad Flatpack (LQFP) with external memory interface (PGF) (F2812)
    • 128-pin LQFP without external memory interface (PBK) (F2810, F2811)
  • Temperature options
    • A: –40°C to 85°C (GHH, ZHH, PGF, PBK)
    • S: –40°C to 125°C (GHH, ZHH, PGF, PBK)
    • Q: –40°C to 125°C (PGF, PBK) (AEC-Q100 qualification for automotive applications)
  • High-performance static CMOS technology
    • 150 MHz (6.67-ns cycle time)
    • Low-power (1.8-V core at 135 MHz, 1.9-V core at 150 MHz, 3.3-V I/O) design
  • JTAG boundary scan support
    • IEEE Standard 1149.1-1990 IEEE Standard Test Access Port and Boundary-Scan Architecture
  • High-performance 32-bit CPU (TMS320C28x)
    • 16 × 16 and 32 × 32 MAC operations
    • 16 × 16 dual MAC
    • Harvard bus architecture
    • Atomic operations
    • Fast interrupt response and processing
    • Unified memory programming model
    • 4M linear program/data address reach
    • Code-efficient (in C/C++ and Assembly)
    • TMS320F24x/LF240x processor source code compatible
  • On-chip memory
    • Up to 128K × 16 flash (Four 8K × 16 and six 16K × 16 sectors)
    • 1K × 16 OTP ROM
    • L0 and L1: 2 blocks of 4K × 16 each Single-Access RAM (SARAM)
    • H0: 1 block of 8K × 16 SARAM
    • M0 and M1: 2 blocks of 1K × 16 each SARAM
  • Boot ROM (4K × 16)
    • With software boot modes
    • Standard math tables
  • External interface (F2812)
    • Over 1M × 16 total memory
    • Programmable wait states
    • Programmable read/write strobe timing
    • Three individual chip selects
  • Endianness: Little endian
  • Clock and system control
    • On-chip oscillator
    • Watchdog timer module
  • Three external interrupts
  • Peripheral Interrupt Expansion (PIE) block that supports 45 peripheral interrupts
  • Three 32-bit CPU timers
  • 128-bit security key/lock
    • Protects flash/OTP and L0/L1 SARAM
    • Prevents firmware reverse-engineering
  • Motor control peripherals
    • Two Event Managers (EVA, EVB)
    • Compatible to 240xA devices
  • Serial port peripherals
    • Serial Peripheral Interface (SPI)
    • Two Serial Communications Interfaces (SCIs), standard UART
    • Enhanced Controller Area Network (eCAN)
    • Multichannel Buffered Serial Port (McBSP)
  • 12-bit ADC, 16 channels
    • 2 × 8 channel input multiplexer
    • Two Sample-and-Hold
    • Single/simultaneous conversions
    • Fast conversion rate: 80 ns/12.5 MSPS
  • Up to 56 General-Purpose I/O (GPIO) pins
  • Advanced emulation features
    • Analysis and breakpoint functions
    • Real-time debug via hardware
  • Development tools include
    • ANSI C/C++ compiler/assembler/linker
    • Code Composer Studio™ IDE
    • DSP/BIOS™
    • JTAG scan controllers
      • IEEE Standard 1149.1-1990 IEEE Standard Test Access Port and Boundary-Scan Architecture
  • Low-power modes and power savings
    • IDLE, STANDBY, HALT modes supported
    • Disable individual peripheral clocks
  • Package options
    • 179-ball MicroStar BGA™ with external memory interface (GHH, ZHH) (F2812)
    • 176-pin Low-Profile Quad Flatpack (LQFP) with external memory interface (PGF) (F2812)
    • 128-pin LQFP without external memory interface (PBK) (F2810, F2811)
  • Temperature options
    • A: –40°C to 85°C (GHH, ZHH, PGF, PBK)
    • S: –40°C to 125°C (GHH, ZHH, PGF, PBK)
    • Q: –40°C to 125°C (PGF, PBK) (AEC-Q100 qualification for automotive applications)

Description

The TMS320F2810, TMS320F2811, and TMS320F2812-Q1 devices, members of the TMS320C28x DSP generation, are highly integrated, high-performance solutions for demanding control applications.

Throughout this document, TMS320F2810, TMS320F2811, and TMS320F2812-Q1 are abbreviated as F2810, F2811, and F2812-Q1, respectively. F281x denotes all three devices.

The TMS320F2810, TMS320F2811, and TMS320F2812-Q1 devices, members of the TMS320C28x DSP generation, are highly integrated, high-performance solutions for demanding control applications.

Throughout this document, TMS320F2810, TMS320F2811, and TMS320F2812-Q1 are abbreviated as F2810, F2811, and F2812-Q1, respectively. F281x denotes all three devices.

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