- Highlights
- High-Performance Digital Media System-on-Chip (DMSoC)
- 432-MHz ARM926EJ-S Clock Rate
- Two Video Image Co-processors (HDVICP, MJCP) Engines
- Supports a Range of Encode, Decode and Video Quality Operations
- Video Processing Subsystem
- HW Face Detect Engine
- Resize Engine from 1/16x to 8x
- 16-Bit Parallel AFE (Analog Front-End) Interface Up to 120 MHz
- 4:2:2 (8-/16-bit) Interface
- 8-/16-bit YCC and Up to 24-Bit RGB888 Digital Output
- 3 DACs for HD Analog Video Output
- Hardware On-Screen Display (OSD)
- Capable of 1080p 30fps H.264 video processing
- Peripherals include EMAC, USB 2.0 OTG, DDR2/NAND, 5 SPIs, 2 UARTs, 2 MMC/SD/SDIO, Key Scan
- 8 Different Boot Modes and Configurable Power-Saving Modes
- Pin-to-pin and software compatible with DM365
- Extended temperature (-40°C - 85°C) available
- 3.3-V and 1.8-V I/O, 1.35-V Core
- 338-Pin Ball Grid Array at 65nm Process Technology
- High-Performance Digital Media System-on-Chip (DMSoC)
- 432-MHz ARM926EJ-S Clock Rate
- 4:2:2 (8-/16-Bit) Interface
- Capable of 1080p 30fps H.264 video processing
- Pin compatible with DM365 processors
- Fully Software-Compatible With ARM9™
- Extended temperature available for 432-Mhz device
- ARM926EJ-S™ Core
- Support for 32-Bit and 16-Bit (Thumb® Mode) Instruction Sets
- DSP Instruction Extensions and Single Cycle MAC
- ARM® Javelle® Technology
- Embedded ICE-RT Logic for Real-Time Debug
- ARM9 Memory Architecture
- 16K-Byte Instruction Cache
- 8K-Byte Data Cache
- 32K-Byte RAM
- 16K-Byte ROM
- Little Endian
- Two Video Image Co-processors (HDVICP, MJCP) Engines
- Support a Range of Encode and Decode Operations
- H.264, MPEG4, MPEG2, MJPEG, JPEG, WMV9/VC1
- Video Processing Subsystem
- Front End Provides:
- HW Face Detect Engine
- Hardware IPIPE for Real-Time Image Processing
- Resize Engine
- Resize Images From 1/16x to 8x
- Separate Horizontal/Vertical Control
- Two Simultaneous Output Paths
- IPIPE Interface (IPIPEIF)
- Image Sensor Interface (ISIF) and CMOS Imager Interface
- 16-Bit Parallel AFE (Analog Front End) Interface Up to 120 MHz
- Glueless Interface to Common Video Decoders
- BT.601/BT.656/BT.1120 Digital YCbCr 4:2:2 (8-/16-Bit) Interface
- Histogram Module
- Lens distortion correction module (LDC)
- Back End Provides:
- Hardware On-Screen Display (OSD)
- Composite NTSC/PAL video encoder output
- 8-/16-bit YCC and Up to 24-Bit RGB888 Digital Output
- 3 DACs for HD Analog Video Output
- LCD Controller
- BT.601/BT.656 Digital YCbCr 4:2:2 (8-/16-Bit) Interface
- Analog-to-Digital Convertor (ADC)
- Power Management and Real Time Clock Subsystem (PRTCSS)
- 16-Bit Host-Port Interface (HPI)
- 10/100 Mb/s Ethernet Media Access Controller (EMAC) - Digital Media
- IEEE 802.3 Compliant
- Supports Media Independent Interface (MII)
- Management Data I/O (MDIO) Module
- Key Scan
- Voice Codec
- External Memory Interfaces (EMIFs)
- DDR2 and mDDR SDRAM 16-bit wide EMIF With 256 MByte Address Space (1.8-V I/O)
- Asynchronous16-/8-bit Wide EMIF (AEMIF)
- Flash Memory Interfaces
- NAND (8-/16-bit Wide Data)
- 16 MB NOR Flash, SRAM
- OneNAND(16-bit Wide Data)
- Flash Card Interfaces
- Two Multimedia Card (MMC) / Secure Digital (SD/SDIO)
- SmartMedia/xD
- Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
- USB Port with Integrated 2.0 High-Speed PHY that Supports
- USB 2.0 High-Speed Device
- USB 2.0 High-Speed Host (mini-host, supporting one external device)
- USB On The Go (HS-USB OTG)
- Four 64-Bit General-Purpose Timers (each configurable as two 32-bit timers)
- One 64-Bit Watch Dog Timer
- Two UARTs (One fast UART with RTS and CTS Flow Control)
- Five Serial Port Interfaces (SPI) each with two Chip-Selects
- One Master/Slave Inter-Integrated Circuit(I2C) Bus™
- One Multi-Channel Buffered Serial Port (McBSP)
- I2S
- AC97 Audio Codec Interface
- S/PDIF via Software
- Standard Voice Codec Interface (AIC12)
- SPI Protocol (Master Mode Only)
- Direct Interface to T1/E1 Framers
- Time Division Multiplexed Mode (TDM)
- 128 Channel Mode
- Four Pulse Width Modulator (PWM) Outputs
- Four RTO (Real Time Out) Outputs
- Up to 104 General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
- Boot Modes
- On-Chip ARM ROM Bootloader (RBL) to Boot From NAND Flash, MMC/SD, UART, USB, SPI, EMAC, or HPI
- AEMIF (NOR and OneNAND)
- Configurable Power-Saving Modes
- Crystal or External Clock Input (typically 19.2 Mhz, 24 MHz, 27 Mhz or 36 MHz)
- Flexible PLL Clock Generators
- Debug Interface Support
- IEEE-1149.1 (JTAG™) Boundary-Scan-Compatible
- ETB (Embedded Trace Buffer) with 4K-Bytes Trace Buffer memory
- Device Revision ID Readable by ARM
- 338-Pin Ball Grid Array (BGA) Package (ZCE Suffix), 0.65-mm Ball Pitch
- 65nm Process Technology
- 3.3-V and 1.8-V I/O, 1.35-V Internal
- Community Reesources
All trademarks are the property of their respective owners.
- Highlights
- High-Performance Digital Media System-on-Chip (DMSoC)
- 432-MHz ARM926EJ-S Clock Rate
- Two Video Image Co-processors (HDVICP, MJCP) Engines
- Supports a Range of Encode, Decode and Video Quality Operations
- Video Processing Subsystem
- HW Face Detect Engine
- Resize Engine from 1/16x to 8x
- 16-Bit Parallel AFE (Analog Front-End) Interface Up to 120 MHz
- 4:2:2 (8-/16-bit) Interface
- 8-/16-bit YCC and Up to 24-Bit RGB888 Digital Output
- 3 DACs for HD Analog Video Output
- Hardware On-Screen Display (OSD)
- Capable of 1080p 30fps H.264 video processing
- Peripherals include EMAC, USB 2.0 OTG, DDR2/NAND, 5 SPIs, 2 UARTs, 2 MMC/SD/SDIO, Key Scan
- 8 Different Boot Modes and Configurable Power-Saving Modes
- Pin-to-pin and software compatible with DM365
- Extended temperature (-40°C - 85°C) available
- 3.3-V and 1.8-V I/O, 1.35-V Core
- 338-Pin Ball Grid Array at 65nm Process Technology
- High-Performance Digital Media System-on-Chip (DMSoC)
- 432-MHz ARM926EJ-S Clock Rate
- 4:2:2 (8-/16-Bit) Interface
- Capable of 1080p 30fps H.264 video processing
- Pin compatible with DM365 processors
- Fully Software-Compatible With ARM9™
- Extended temperature available for 432-Mhz device
- ARM926EJ-S™ Core
- Support for 32-Bit and 16-Bit (Thumb® Mode) Instruction Sets
- DSP Instruction Extensions and Single Cycle MAC
- ARM® Javelle® Technology
- Embedded ICE-RT Logic for Real-Time Debug
- ARM9 Memory Architecture
- 16K-Byte Instruction Cache
- 8K-Byte Data Cache
- 32K-Byte RAM
- 16K-Byte ROM
- Little Endian
- Two Video Image Co-processors (HDVICP, MJCP) Engines
- Support a Range of Encode and Decode Operations
- H.264, MPEG4, MPEG2, MJPEG, JPEG, WMV9/VC1
- Video Processing Subsystem
- Front End Provides:
- HW Face Detect Engine
- Hardware IPIPE for Real-Time Image Processing
- Resize Engine
- Resize Images From 1/16x to 8x
- Separate Horizontal/Vertical Control
- Two Simultaneous Output Paths
- IPIPE Interface (IPIPEIF)
- Image Sensor Interface (ISIF) and CMOS Imager Interface
- 16-Bit Parallel AFE (Analog Front End) Interface Up to 120 MHz
- Glueless Interface to Common Video Decoders
- BT.601/BT.656/BT.1120 Digital YCbCr 4:2:2 (8-/16-Bit) Interface
- Histogram Module
- Lens distortion correction module (LDC)
- Back End Provides:
- Hardware On-Screen Display (OSD)
- Composite NTSC/PAL video encoder output
- 8-/16-bit YCC and Up to 24-Bit RGB888 Digital Output
- 3 DACs for HD Analog Video Output
- LCD Controller
- BT.601/BT.656 Digital YCbCr 4:2:2 (8-/16-Bit) Interface
- Analog-to-Digital Convertor (ADC)
- Power Management and Real Time Clock Subsystem (PRTCSS)
- 16-Bit Host-Port Interface (HPI)
- 10/100 Mb/s Ethernet Media Access Controller (EMAC) - Digital Media
- IEEE 802.3 Compliant
- Supports Media Independent Interface (MII)
- Management Data I/O (MDIO) Module
- Key Scan
- Voice Codec
- External Memory Interfaces (EMIFs)
- DDR2 and mDDR SDRAM 16-bit wide EMIF With 256 MByte Address Space (1.8-V I/O)
- Asynchronous16-/8-bit Wide EMIF (AEMIF)
- Flash Memory Interfaces
- NAND (8-/16-bit Wide Data)
- 16 MB NOR Flash, SRAM
- OneNAND(16-bit Wide Data)
- Flash Card Interfaces
- Two Multimedia Card (MMC) / Secure Digital (SD/SDIO)
- SmartMedia/xD
- Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
- USB Port with Integrated 2.0 High-Speed PHY that Supports
- USB 2.0 High-Speed Device
- USB 2.0 High-Speed Host (mini-host, supporting one external device)
- USB On The Go (HS-USB OTG)
- Four 64-Bit General-Purpose Timers (each configurable as two 32-bit timers)
- One 64-Bit Watch Dog Timer
- Two UARTs (One fast UART with RTS and CTS Flow Control)
- Five Serial Port Interfaces (SPI) each with two Chip-Selects
- One Master/Slave Inter-Integrated Circuit(I2C) Bus™
- One Multi-Channel Buffered Serial Port (McBSP)
- I2S
- AC97 Audio Codec Interface
- S/PDIF via Software
- Standard Voice Codec Interface (AIC12)
- SPI Protocol (Master Mode Only)
- Direct Interface to T1/E1 Framers
- Time Division Multiplexed Mode (TDM)
- 128 Channel Mode
- Four Pulse Width Modulator (PWM) Outputs
- Four RTO (Real Time Out) Outputs
- Up to 104 General-Purpose I/O (GPIO) Pins (Multiplexed with Other Device Functions)
- Boot Modes
- On-Chip ARM ROM Bootloader (RBL) to Boot From NAND Flash, MMC/SD, UART, USB, SPI, EMAC, or HPI
- AEMIF (NOR and OneNAND)
- Configurable Power-Saving Modes
- Crystal or External Clock Input (typically 19.2 Mhz, 24 MHz, 27 Mhz or 36 MHz)
- Flexible PLL Clock Generators
- Debug Interface Support
- IEEE-1149.1 (JTAG™) Boundary-Scan-Compatible
- ETB (Embedded Trace Buffer) with 4K-Bytes Trace Buffer memory
- Device Revision ID Readable by ARM
- 338-Pin Ball Grid Array (BGA) Package (ZCE Suffix), 0.65-mm Ball Pitch
- 65nm Process Technology
- 3.3-V and 1.8-V I/O, 1.35-V Internal
- Community Reesources
All trademarks are the property of their respective owners.