CFP (HKT)-16-72.136 mm² 10.16 x 7.1

The TMP9R00-SP device is a radiation-hardened, multi-zone, high-accuracy, low-power temperature sensor using a two-wire, SMBus or I²C compatible interface. Up to eight remote and one local temperature zones can be monitored simultaneously, aggregating the temperature measurements in a system reducing design complexity. Typical use cases are monitoring temperature of different high power devices, such as MCUs, GPUs, ADCs, DACs and FPGAs. Advanced features such as series resistance cancellation, programmable ideality factor, temperature offset correction, and temperature limits are included to provide a robust thermal monitoring solution.

Each remote channel and the local channel have two independently programmable thresholds that trigger when the corresponding temperature exceeds the limit. A programmable hysteresis setting is available to avoid toggling around the threshold.

The TMP9R00-SP device provides high accuracy (±1.5°C) and high resolution (0.0625°C) measurement capabilities. The device supports low voltage rails (1.7 V to 2.0 V), common two-wire interfaces (1.7 V to 3.6 V), and an operating temperature range from –55°C to 125°C and a remote junction temperature range from –55°C to 150°C.