Product
0
SN74AUC1G126
  • SN74AUC1G126
  • SN74AUC1G126
  • SN74AUC1G126
  • SN74AUC1G126

SN74AUC1G126

ACTIVE

Single 0.8-V to 2.7-V high speed buffer with 3-state outputs

Texas Instruments SN74AUC1G126 Product Info

1 April 2026 6

Parameters

Technology family

AUC

Supply voltage (min) (V)

0.8

Supply voltage (max) (V)

2.7

Number of channels

1

IOL (max) (mA)

9

Supply current (max) (µA)

10

IOH (max) (mA)

-9

Input type

Standard CMOS

Output type

3-State

Features

Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Ultra high speed (tpd <5ns)

Rating

Catalog

Operating temperature range (°C)

-40 to 85

Package

DSBGA (YZP)-5-2.1875 mm² 1.75 x 1.25

Features

  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Available in TI’s NanoFree™ Package
  • Optimized for 1.8-V Operation and is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial Power Down Mode and Back Drive Protection
  • Sub-1 V Operable
  • Maximum tpd of 2.5 ns at 1.8 V
  • Low Power Consumption, 10-µA Maximum ICC
  • ±8-mA Output Drive at 1.8 V
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Available in TI’s NanoFree™ Package
  • Optimized for 1.8-V Operation and is 3.6-V I/O Tolerant to Support Mixed-Mode Signal Operation
  • Ioff Supports Partial Power Down Mode and Back Drive Protection
  • Sub-1 V Operable
  • Maximum tpd of 2.5 ns at 1.8 V
  • Low Power Consumption, 10-µA Maximum ICC
  • ±8-mA Output Drive at 1.8 V

Description

The SN74AUC1G126 bus buffer gate is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation.

The SN74AUC1G126 device is a single line driver with a tri-state output. The output is disabled when the output-enable (OE) input is low.

To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver.

NanoFree™ package technology is a major breakthrough in device packaging concepts, using the die as the package.

This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, which prevents damaging current backflow through the device when it is powered down.

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8