- Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
- Extended Temperature Performance of -55°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree(1)
- 100-Mbps to 660-Mbps Serial LVDS Data Payload Bandwidth at 10-MHz to 66-MHz System Clock
- Pin-Compatible Superset of DS92LV1023/DS92LV1224
- Chipset (Serializer/Deserializer) Power Consumption <450 mW (Typ) at 66 MHz
- Synchronization Mode for Faster Lock
- Lock Indicator
- No External Components Required for PLL
- 28-Pin SSOP and Space Saving 5 × 5 mm QFN Packages Available
- Programmable Edge Trigger on Clock
- Flow-Through Pinout for Easy PCB Layout
(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
- Controlled Baseline
- One Assembly/Test Site, One Fabrication Site
- Extended Temperature Performance of -55°C to 125°C
- Enhanced Diminishing Manufacturing Sources (DMS) Support
- Enhanced Product-Change Notification
- Qualification Pedigree(1)
- 100-Mbps to 660-Mbps Serial LVDS Data Payload Bandwidth at 10-MHz to 66-MHz System Clock
- Pin-Compatible Superset of DS92LV1023/DS92LV1224
- Chipset (Serializer/Deserializer) Power Consumption <450 mW (Typ) at 66 MHz
- Synchronization Mode for Faster Lock
- Lock Indicator
- No External Components Required for PLL
- 28-Pin SSOP and Space Saving 5 × 5 mm QFN Packages Available
- Programmable Edge Trigger on Clock
- Flow-Through Pinout for Easy PCB Layout
(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.
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