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LMZ31506H
  • LMZ31506H

LMZ31506H

ACTIVE

6A Power Module with 4.5V-14.5V Input in QFN package

Texas Instruments LMZ31506H Product Info

1 April 2026 1

Parameters

Rating

Catalog

Topology

Buck, Synchronous Buck

Iout (max) (A)

6

Vin (max) (V)

14.5

Vin (min) (V)

4.5

Vout (max) (V)

5.5

Vout (min) (V)

1.2

Features

EMI Tested, Enable, Frequency synchronization, Power good, Remote Sense, Tracking

Operating temperature range (°C)

-40 to 85

Type

Module

Duty cycle (max) (%)

100

Control mode

current mode

Switching frequency (min) (kHz)

480

Switching frequency (max) (kHz)

780

Package

B1QFN (RUQ)-47-135 mm² 15 x 9

Features

  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • 9-mm × 15-mm × 2.8-mm package
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    1.2 V to 5.5 V, with 1% Reference Accuracy
  • Optional Split Power Rail allows
    Input Voltage Down to 1.7 V
  • Adjustable Switching Frequency
    (480 kHz to 780 kHz)
  • Synchronizes to an External Clock
  • Adjustable Slow-Start
  • Output Voltage Sequencing and Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Output Overcurrent Protection
  • Over Temperature Protection
  • Pre-bias Output Start-up
  • Operating Temperature Range: –40°C to +85°C
  • Enhanced Thermal Performance: 13°C/W
  • Meets EN55022 Class B Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ31506H With the WEBENCH® Power Designer
  • Complete Integrated Power Solution Allows
    Small Footprint, Low-Profile Design
  • 9-mm × 15-mm × 2.8-mm package
  • Efficiencies Up To 96%
  • Wide-Output Voltage Adjust
    1.2 V to 5.5 V, with 1% Reference Accuracy
  • Optional Split Power Rail allows
    Input Voltage Down to 1.7 V
  • Adjustable Switching Frequency
    (480 kHz to 780 kHz)
  • Synchronizes to an External Clock
  • Adjustable Slow-Start
  • Output Voltage Sequencing and Tracking
  • Power Good Output
  • Programmable Undervoltage Lockout (UVLO)
  • Output Overcurrent Protection
  • Over Temperature Protection
  • Pre-bias Output Start-up
  • Operating Temperature Range: –40°C to +85°C
  • Enhanced Thermal Performance: 13°C/W
  • Meets EN55022 Class B Emissions
    - Integrated Shielded Inductor
  • Create a Custom Design Using the LMZ31506H With the WEBENCH® Power Designer

Description

The LMZ31506H power module is an easy-to-use integrated power solution that combines a 6-A DC-to-DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as 3 external components and eliminates the loop compensation and magnetics part selection process.

The 9×15×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow.

The LMZ31506H offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

The LMZ31506H power module is an easy-to-use integrated power solution that combines a 6-A DC-to-DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as 3 external components and eliminates the loop compensation and magnetics part selection process.

The 9×15×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow.

The LMZ31506H offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.

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