0
ACTIVE
Rating |
Catalog |
Topology |
Buck, Synchronous Buck |
Iout (max) (A) |
6 |
Vin (max) (V) |
14.5 |
Vin (min) (V) |
2.95 |
Vout (max) (V) |
5.5 |
Vout (min) (V) |
0.6 |
Features |
Current Sharing, EMI Tested, Enable, Frequency synchronization, Power good, Remote Sense, Tracking |
Operating temperature range (°C) |
-40 to 85 |
Type |
Module |
Duty cycle (max) (%) |
100 |
Control mode |
current mode |
Switching frequency (min) (kHz) |
250 |
Switching frequency (max) (kHz) |
780 |
B1QFN (RUQ)-47-135 mm² 15 x 9
The LMZ31506 power module is an easy-to-use integrated power solution that combines a 6-A DC-to-DC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package. This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.
The 9×15×2.8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient. The device delivers the full 6-A rated output current at 85°C ambient temperature without airflow.
The LMZ31506 offers the flexibility and the feature-set of a discrete point-of-load design and is ideal for powering performance DSPs and FPGAs. Advanced packaging technology afford a robust and reliable power solution compatible with standard QFN mounting and testing techniques.
WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK
