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CSD96416
  • CSD96416
  • CSD96416

CSD96416

ACTIVE

50-A peak continuous current synchronous buck NexFET™ smart power stage

Texas Instruments CSD96416 Product Info

1 April 2026 1

Parameters

Rating

Catalog

VDS (V)

25

Ploss current (A)

25

Features

Analog temperature output, Catastrophic over-current protection, Cycle-by-cycle over-current protection, Diode emulation mode with FCCM, Industry common footprint, Integrated current sense, Negative over-current protection, Powerstack vertical FET integration, Smart-current sharing, Ultra-low inductance package

Operating temperature range (°C)

-40 to 125

Package

VQFN-CLIP (RWJ)-41-30 mm² 6 x 5

Features

  • Peak current rating: 50 A
  • 16-V VIN, 25-V high-side and low-side FET
  • Adjusted deadtime trim to improve transient response with non-TI controller
  • Peak efficiency (fSW = 600 kHz, LOUT = 150 nH): over 94%
  • High-frequency operation (up to 1.75 MHz)
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • 3.3-V and 5-V PWM signal compatible
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized dead-time for shoot-through protection
  • High-density, QFN 5-mm × 6-mm footprint
  • Ultra-low-inductance package
  • System optimized PCB footprint
  • Thermally enhanced topside cooling
  • RoHS compliant, lead-free terminal plating
  • Halogen free
  • Peak current rating: 50 A
  • 16-V VIN, 25-V high-side and low-side FET
  • Adjusted deadtime trim to improve transient response with non-TI controller
  • Peak efficiency (fSW = 600 kHz, LOUT = 150 nH): over 94%
  • High-frequency operation (up to 1.75 MHz)
  • Temperature compensated bi-directional current sense
  • Analog temperature output
  • Fault monitoring
  • 3.3-V and 5-V PWM signal compatible
  • Tri-state PWM input
  • Integrated bootstrap switch
  • Optimized dead-time for shoot-through protection
  • High-density, QFN 5-mm × 6-mm footprint
  • Ultra-low-inductance package
  • System optimized PCB footprint
  • Thermally enhanced topside cooling
  • RoHS compliant, lead-free terminal plating
  • Halogen free

Description

The CSD96416 NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm package. This power stage has an adjusted deadtime trim to improve transient response with non-TI controller. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

The CSD96416 NexFET™ power stage is a highly optimized design for use in a high-power, high-density synchronous buck converter. This product integrates the driver and power MOSFETs to complete the power stage switching function. This combination produces high-current, high-efficiency, and high-speed switching capability in a small 5-mm × 6-mm package. This power stage has an adjusted deadtime trim to improve transient response with non-TI controller. It also integrates the accurate current sensing and temperature sensing functionality to simplify system design and improve accuracy. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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