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CSD96370Q5M
  • CSD96370Q5M
  • CSD96370Q5M

CSD96370Q5M

ACTIVE

High Frequency Synchronous Buck NexFET™ Power Stage

Texas Instruments CSD96370Q5M Product Info

1 April 2026 3

Parameters

Rating

Catalog

VDS (V)

25

Ploss current (A)

25

Features

Ultra-low inductance package

Operating temperature range (°C)

-55 to 150

Package

LSON-CLIP (DQP)-22-30 mm² 6 x 5

Features

  • 90% System Efficiency at 25A
  • High Frequency Operation (Up To 2MHz)
  • Incorporates Power Block Technology
  • High Density – SON 5-mm × 6-mm Footprint
  • Low Power Loss 2.6W at 25A
  • Ultra Low Inductance Package
  • System Optimized PCB Footprint
  • 3.3V and 5V PWM Signal Compatible
  • 3-State PWM Input
  • Integrated Bootstrap Diode
  • Pre-Bias Start-Up Protection
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating Halogen Free
  • APPLICATIONS
    • Synchronous Buck Converters
    • Multiphase Synchronous Buck Converters
    • POL DC-DC Converters
    • Memory and Graphic Cards
    • Desktop and Server VR11.x and VR12 V-Core
      Synchronous Buck Converters

  • 90% System Efficiency at 25A
  • High Frequency Operation (Up To 2MHz)
  • Incorporates Power Block Technology
  • High Density – SON 5-mm × 6-mm Footprint
  • Low Power Loss 2.6W at 25A
  • Ultra Low Inductance Package
  • System Optimized PCB Footprint
  • 3.3V and 5V PWM Signal Compatible
  • 3-State PWM Input
  • Integrated Bootstrap Diode
  • Pre-Bias Start-Up Protection
  • Shoot Through Protection
  • RoHS Compliant – Lead Free Terminal Plating Halogen Free
  • APPLICATIONS
    • Synchronous Buck Converters
    • Multiphase Synchronous Buck Converters
    • POL DC-DC Converters
    • Memory and Graphic Cards
    • Desktop and Server VR11.x and VR12 V-Core
      Synchronous Buck Converters

Description

The CSD96370Q5M NexFET Power Stage is an optimized design for use in a high power, high density Synchronous Buck converter. This product integrates an enhanced gate driver IC and Power Block Technology to complete the power stage switching function. This combination produces a high current, high efficiency, high speed switching device and delivers an excellent thermal solution in a small 5-mm × 6-mm outline package due to its large ground based thermal pad. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.

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