- High-Performance Sitara ARM Microprocessors (MPUs)
- ARMCortex-A8 RISC Processor
- ARM Cortex-A8 Core
- ARMv7 Architecture
- In-Order, Dual-Issue, Superscalar Processor Core
- NEON Multimedia Architecture
- Supports Integer and Floating Point (VFPv3-IEEE754 Compliant)
- Jazelle RCT Execution Environment
- ARM Cortex-A8 Memory Architecture
- 32-KB Instruction and Data Caches
- 256-KB L2 Cache
- 64-KB RAM, 48-KB of Boot ROM
- 512KB of On-Chip Memory Controller (OCMC) RAM
- SGX530 3D Graphics Engine (Available Only on the AM3894 Device)
- Delivers up to 30 MTriangles per Second
- Universal Scalable Shader Engine
- Direct3D Mobile, OpenGL ES 1.1 and 2.0, OpenVG 1.1, OpenMax API Support
- Advanced Geometry DMA Driven Operation
- Programmable HQ Image Anti-Aliasing
- Endianness
- ARM Instructions and Data – Little Endian
- HD Video Processing Subsystem (HDVPSS)
- Two 165-MHz HD Video Capture Channels
- One 16-Bit or 24-Bit and One 16-Bit Channel
- Each Channel Splittable Into Dual 8-Bit Capture Channels
- Two 165-MHz HD Video Display Channels
- One 16-Bit, 24-Bit, 30-Bit Channel and One 16-Bit Channel
- Simultaneous SD and HD Analog Output
- Digital HDMI 1.3 Transmitter with PHY with HDCP up to 165-MHz Pixel Clock
- Three Graphics Layers
- Dual 32-Bit DDR2 and DDR3 SDRAM Interfaces
- Supports up to DDR2-800 and DDR3-1600
- Up to Eight x8 Devices Total
- 2GB of Total Address Space
- Dynamic Memory Manager (DMM)
- Programmable Multi-Zone Memory Mapping and Interleaving
- Enables Efficient 2D Block Accesses
- Supports Tiled Objects in 0°, 90°, 180°, or 270° Orientation and Mirroring
- Optimizes Interlaced Accesses
- One PCI Express (PCIe) 2.0 Port with Integrated PHY
- Single Port with 1 or 2 Lanes at 5.0 GT per Second
- Configurable as Root Complex or Endpoint
- Serial ATA (SATA) 3.0 Gbps Controller with Integrated PHYs
- Direct Interface for Two Hard Disk Drives
- Hardware-Assisted Native Command Queuing (NCQ) from up to 32 Entries
- Supports Port Multiplier and Command-Based Switching
- Two 10 Mbps, 100 Mbps, and 1000 Mbps Ethernet MACs (EMAC)
- IEEE 802.3 Compliant (3.3-V I/O Only)
- MII and GMII Media Independent Interfaces
- Management Data I/O (MDIO) Module
- Dual USB 2.0 Ports with Integrated PHYs
- USB 2.0 High-Speed and Full-Speed Client
- USB 2.0 High-Speed, Full-Speed, and Low-Speed Host
- Supports Endpoints 0-15
- General-Purpose Memory Controller (GPMC)
- 8-Bit and 16-Bit Multiplexed Address and Data Bus
- Up to 6 Chip Selects with up to 256-MB Address Space per Chip Select Pin
- Glueless Interface to NOR Flash, NAND Flash (with BCH and Hamming Error Code Detection), SRAM and Pseudo-SRAM
- Error Locator Module (ELM) Outside of GPMC to Provide up to 16-Bit and 512-Byte Hardware ECC for NAND
- Flexible Asynchronous Protocol Control for Interface to FPGA, CPLD, ASICs
- Enhanced Direct-Memory-Access (EDMA) Controller
- Four Transfer Controllers
- 64 Independent DMA Channels and 8 Quick DMA (QDMA) Channels
- Seven 32-Bit General-Purpose Timers
- One System Watchdog Timer
- Three Configurable UART, IrDA, and CIR Modules
- UART0 with Modem Control Signals
- Supports up to 3.6864 Mbps UART
- SIR, MIR, FIR (4.0 MBAUD), and CIR
- One 40-MHz Serial Peripheral Interface (SPI) with Four Chip Selects
- SD and SDIO Serial Interface (1-Bit and 4-Bit)
- Dual Inter-Integrated Circuit (I2C bus) Ports
- Three Multichannel Audio Serial Ports (McASPs)
- One Six-Serializer Transmit and Receive Port
- Two Dual-Serializer Transmit and Receive Ports
- DIT-Capable For SDIF and PDIF (All Ports)
- Multichannel Buffered Serial Port (McBSP)
- Transmit and Receive Clocks up to 48 MHz
- Two Clock Zones and Two Serial Data Pins
- Supports TDM, I2S, and Similar Formats
- Real-Time Clock (RTC)
- One-Time or Periodic Interrupt Generation
- Up to 64 General-Purpose I/O (GPIO) Pins
- On-Chip ARM ROM Bootloader (RBL)
- Power, Reset, and Clock Management
- SmartReflex Technology (Level 2)
- Seven Independent Core Power Domains
- Clock Enable and Disable Control For Subsystems and Peripherals
- IEEE 1149.1 (JTAG) and IEEE 1149.7 (cJTAG) Compatible
- Via Channel Technology Enables use of
0.8-mm Design Rules - 40-nm CMOS Technology
- 3.3-V Single-Ended LVCMOS I/Os (Except for DDR3 at 1.5 V, DDR2 at 1.8 V, and DEV_CLKIN at 1.8 V)
- High-Performance Sitara ARM Microprocessors (MPUs)
- ARMCortex-A8 RISC Processor
- ARM Cortex-A8 Core
- ARMv7 Architecture
- In-Order, Dual-Issue, Superscalar Processor Core
- NEON Multimedia Architecture
- Supports Integer and Floating Point (VFPv3-IEEE754 Compliant)
- Jazelle RCT Execution Environment
- ARM Cortex-A8 Memory Architecture
- 32-KB Instruction and Data Caches
- 256-KB L2 Cache
- 64-KB RAM, 48-KB of Boot ROM
- 512KB of On-Chip Memory Controller (OCMC) RAM
- SGX530 3D Graphics Engine (Available Only on the AM3894 Device)
- Delivers up to 30 MTriangles per Second
- Universal Scalable Shader Engine
- Direct3D Mobile, OpenGL ES 1.1 and 2.0, OpenVG 1.1, OpenMax API Support
- Advanced Geometry DMA Driven Operation
- Programmable HQ Image Anti-Aliasing
- Endianness
- ARM Instructions and Data – Little Endian
- HD Video Processing Subsystem (HDVPSS)
- Two 165-MHz HD Video Capture Channels
- One 16-Bit or 24-Bit and One 16-Bit Channel
- Each Channel Splittable Into Dual 8-Bit Capture Channels
- Two 165-MHz HD Video Display Channels
- One 16-Bit, 24-Bit, 30-Bit Channel and One 16-Bit Channel
- Simultaneous SD and HD Analog Output
- Digital HDMI 1.3 Transmitter with PHY with HDCP up to 165-MHz Pixel Clock
- Three Graphics Layers
- Dual 32-Bit DDR2 and DDR3 SDRAM Interfaces
- Supports up to DDR2-800 and DDR3-1600
- Up to Eight x8 Devices Total
- 2GB of Total Address Space
- Dynamic Memory Manager (DMM)
- Programmable Multi-Zone Memory Mapping and Interleaving
- Enables Efficient 2D Block Accesses
- Supports Tiled Objects in 0°, 90°, 180°, or 270° Orientation and Mirroring
- Optimizes Interlaced Accesses
- One PCI Express (PCIe) 2.0 Port with Integrated PHY
- Single Port with 1 or 2 Lanes at 5.0 GT per Second
- Configurable as Root Complex or Endpoint
- Serial ATA (SATA) 3.0 Gbps Controller with Integrated PHYs
- Direct Interface for Two Hard Disk Drives
- Hardware-Assisted Native Command Queuing (NCQ) from up to 32 Entries
- Supports Port Multiplier and Command-Based Switching
- Two 10 Mbps, 100 Mbps, and 1000 Mbps Ethernet MACs (EMAC)
- IEEE 802.3 Compliant (3.3-V I/O Only)
- MII and GMII Media Independent Interfaces
- Management Data I/O (MDIO) Module
- Dual USB 2.0 Ports with Integrated PHYs
- USB 2.0 High-Speed and Full-Speed Client
- USB 2.0 High-Speed, Full-Speed, and Low-Speed Host
- Supports Endpoints 0-15
- General-Purpose Memory Controller (GPMC)
- 8-Bit and 16-Bit Multiplexed Address and Data Bus
- Up to 6 Chip Selects with up to 256-MB Address Space per Chip Select Pin
- Glueless Interface to NOR Flash, NAND Flash (with BCH and Hamming Error Code Detection), SRAM and Pseudo-SRAM
- Error Locator Module (ELM) Outside of GPMC to Provide up to 16-Bit and 512-Byte Hardware ECC for NAND
- Flexible Asynchronous Protocol Control for Interface to FPGA, CPLD, ASICs
- Enhanced Direct-Memory-Access (EDMA) Controller
- Four Transfer Controllers
- 64 Independent DMA Channels and 8 Quick DMA (QDMA) Channels
- Seven 32-Bit General-Purpose Timers
- One System Watchdog Timer
- Three Configurable UART, IrDA, and CIR Modules
- UART0 with Modem Control Signals
- Supports up to 3.6864 Mbps UART
- SIR, MIR, FIR (4.0 MBAUD), and CIR
- One 40-MHz Serial Peripheral Interface (SPI) with Four Chip Selects
- SD and SDIO Serial Interface (1-Bit and 4-Bit)
- Dual Inter-Integrated Circuit (I2C bus) Ports
- Three Multichannel Audio Serial Ports (McASPs)
- One Six-Serializer Transmit and Receive Port
- Two Dual-Serializer Transmit and Receive Ports
- DIT-Capable For SDIF and PDIF (All Ports)
- Multichannel Buffered Serial Port (McBSP)
- Transmit and Receive Clocks up to 48 MHz
- Two Clock Zones and Two Serial Data Pins
- Supports TDM, I2S, and Similar Formats
- Real-Time Clock (RTC)
- One-Time or Periodic Interrupt Generation
- Up to 64 General-Purpose I/O (GPIO) Pins
- On-Chip ARM ROM Bootloader (RBL)
- Power, Reset, and Clock Management
- SmartReflex Technology (Level 2)
- Seven Independent Core Power Domains
- Clock Enable and Disable Control For Subsystems and Peripherals
- IEEE 1149.1 (JTAG) and IEEE 1149.7 (cJTAG) Compatible
- Via Channel Technology Enables use of
0.8-mm Design Rules - 40-nm CMOS Technology
- 3.3-V Single-Ended LVCMOS I/Os (Except for DDR3 at 1.5 V, DDR2 at 1.8 V, and DEV_CLKIN at 1.8 V)