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IM73A135
  • IM73A135

IM73A135

Active and preferred

Infineon's XENSIV™ analog MEMS microphone, IM73A135, sets a new performance benchmark with a best-in-class SNR of 73 dB and high acoustic overload point of 135 dBSPL. Sealed Dual Membrane (SDM) MEMS technology provides high IP57 ingress protection at a microphone level. The IM73A135 achieves superior audio performance, previously only achievable by ECMs while harnessing the advantages of MEMS technology.

Infineon Technologies IM73A135 Product Info

16 April 2026 1

Parameters

AEC-Q103-003 qualified

on demand

AOP

135 dBSPL

Current Consumption

170 µA

Green

RoHS compliant, Halogen free

Interfaces

Analog differential

LFRO

20 Hz

Package dimensions

4.00 x 3.00 x 1.20 mm³

Sensitivity

-38 dBV

SNR

73 dB(A)

Supply Voltage

1.52 - 3.00 V

Apps

Mobile device and smartphone solutions, Smart speaker designs, Security camera and video doorbell

Features

  • Ultra-low self-noise / ultra-high SNR (73 dB)
  • Selectable power modes for battery critical applications (170/70 µA)
  • Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
  • Ultra high dynamic range and very high acoustic overload point (AOP) of 135 dBSPL
  • Very tight part-to-part phase and sensitivity matching (± 1 dB)
  • Flat frequency response with a very low LFRO (low frequency roll-off) of 20Hz
  • Ultra-low group delay (2µs @ 1kHz)

Description

  • Crystal clear audio pick up of the quietest and the loudest sounds
  • High ingress protection (IP57) at a microphone level
  • Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)

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