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IM73A135
  • IM73A135

IM73A135

Active and preferred

Infineon's XENSIV™ analog MEMS microphone, IM73A135, sets a new performance benchmark with a best-in-class SNR of 73 dB and high acoustic overload point of 135 dBSPL. Sealed Dual Membrane (SDM) MEMS technology provides high IP57 ingress protection at a microphone level. The IM73A135 achieves superior audio performance, previously only achievable by ECMs while harnessing the advantages of MEMS technology.

Infineon Technologies IM73A135 Product Info

16 April 2026 21

Parameters

AEC-Q103-003 qualified

on demand

AOP

135 dBSPL

Current Consumption

170 µA

Green

RoHS compliant, Halogen free

Interfaces

Analog differential

LFRO

20 Hz

Package dimensions

4.00 x 3.00 x 1.20 mm³

Sensitivity

-38 dBV

SNR

73 dB(A)

Supply Voltage

1.52 - 3.00 V

Apps

Mobile device and smartphone solutions, Smart speaker designs, Security camera and video doorbell

Features

  • Ultra-low self-noise / ultra-high SNR (73 dB)
  • Selectable power modes for battery critical applications (170/70 µA)
  • Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
  • Ultra high dynamic range and very high acoustic overload point (AOP) of 135 dBSPL
  • Very tight part-to-part phase and sensitivity matching (± 1 dB)
  • Flat frequency response with a very low LFRO (low frequency roll-off) of 20Hz
  • Ultra-low group delay (2µs @ 1kHz)

Description

  • Crystal clear audio pick up of the quietest and the loudest sounds
  • High ingress protection (IP57) at a microphone level
  • Enablement of advanced audio features (ANC, transparent hearing, audio zoom, beamforming)

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