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FS770R08A6P2LB
  • FS770R08A6P2LB

FS770R08A6P2LB

Active and preferred

The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications . The product FS770R08A6P2LB comes with a baseplate with bonded cooling structure.

Infineon Technologies FS770R08A6P2LB Product Info

16 April 2026 0

Parameters

Applications

CAV, eMobility, Hybrid Electric Vehicles, Drives

Configuration

Sixpack

Cooling Concept

Wave baseplate

Dimensions (length)

152 mm

Dimensions (width)

92 mm

Features

Wave Baseplate, Long Tabs

Housing

HybridPACK™ Drive

IC(nom) / IF(nom)

770 A

IC max

1540 A

Launch year

2019

Planned to be available until at least

2034

Qualification

Automotive

Technology

IGBT EDT2

VCE(sat) (Tvj=25°C typ)

1.1 V

VCES (Tvj=25°C typ)

750 V

VF (Tvj=25°C typ)

1.45 V

Voltage Class max

750 V

Features

  • Blocking voltage 750V
  • Low VCEsat
  • Low Switching Losses
  • Low Qg and Cres
  • Low Inductive Design
  • Tvj op = 150°C
  • Short-time ext Op Tvj op = 175°C

Description

  • Compact Design
  • Integrated NTC temperature sensor
  • PressFIT Contact Technology
  • RoHS compliant
  • Mechanical guiding elements
  • Long tabs for current sense

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