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FS3L50R07W2H3_B11
  • FS3L50R07W2H3_B11

FS3L50R07W2H3_B11

Active and preferred

EasyPACK™ 2B 650 V 3-level NPC1 full-bridge IGBT module with NTC and PressFIT Contact Technology

Infineon Technologies FS3L50R07W2H3_B11 Product Info

16 April 2026 0

Parameters

Configuration

3-level

Dimensions (width)

48 mm

Dimensions (length)

56.7 mm

Features

PressFIT

Housing

EasyPACK™ 2B

IC(nom) / IF(nom)

50 A

IC max

50 A

Qualification

Industrial

Technology

IGBT3 - H3

VCE(sat) (Tvj=25°C typ)

1.45 V

VCES / VRRM

650 V

VF (Tvj=25°C typ)

1.6 V

Voltage Class max

650 V

Apps

Photovoltaic, Motor control, Uninterruptible power supplies (UPS)

Features

  • High Speed IGBT H3
  • Low switching losses
  • Fast Si clamping diodes 25 A, 650 V
  • PressFIT contact technology
  • Integrated mounting clamps
  • Al2O3 substrate with:
  • Low thermal resistance

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