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FS1000R08A7P3B
  • FS1000R08A7P3B

FS1000R08A7P3B

Active and preferred

The power module implements Infineon’s next generation chip technology EDT3 750V, optimized for electric drive train applications, from mid- to high-range automotive power classes.

Infineon Technologies FS1000R08A7P3B Product Info

16 April 2026 0

Parameters

Configuration

Sixpack

Features

PinFin Base Plate

Housing

HybridPACK™ Drive G2

IC(nom) / IF(nom)

600 A

Launch year

2025

Planned to be available until at least

2035

Qualification

Automotive

Technology

IGBT EDT3

VCES (Tvj=25°C typ)

750 V

Voltage Class max

750 V

Features

  • VCES = 750 V
  • ICN = 1000 A / ICRM = 2000 A
  • Low VCE,sat
  • Low switching losses
  • Low Qg and Crss
  • Low inductive design
  • Tvj,op = 175°C
  • Integrated on-chip temperature sensor
  • Short-term temp up to 185°C
  • Direct-cooled PinFin base plate
  • PCB and cooler assembly guides
  • PressFIT contact technology

Description

  • Higher temperature cycling capability
  • Integrated diode temperature sensors
  • New plastic material
  • Better temperature capability
  • New frame design for lower system BOM
  • Lower AC contact resistance and tab temp
  • PressFIT Contact Technology
  • RoHS compliant
  • Completely Pb free
  • Superior reliability

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