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FF650R17IE4P
  • FF650R17IE4P

FF650R17IE4P

Active and preferred

PrimePACK™ 2 1700 V, 650 A half-bridge dual IGBT module with TRENCHSTOP™ IGBT4, NTC, fast switching chip and Thermal Interface Material .

Infineon Technologies FF650R17IE4P Product Info

16 April 2026 0

Parameters

Configuration

half-bridge

Dimensions (length)

172 mm

Dimensions (width)

89 mm

Features

TIM

Housing

PrimePACK™ 2

IC(nom) / IF(nom)

650 A

IC max

650 A

Qualification

Industrial

Technology

IGBT4 - E4

VCE(sat) (Tvj=25°C typ)

2 V

VCES / VRRM

1700 V

VF (Tvj=25°C typ)

1.85 V

Voltage Class max

1700 V

Apps

Wind power, Motor control

Features

  • Extended operation temp. Tvj op
  • High DC stability
  • High current density
  • Low switching losses
  • Tvj op = 150°C
  • Low VCEsat
  • Package with CTI > 400
  • High creepage & clearance distances
  • High power & thermal cycling capab.
  • Copper base plate
  • UL recognized

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