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CYW55513
  • CYW55513

CYW55513

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The high-performance, versatile AIROC™ CYW55513 tri-band Wi-Fi 6E and Bluetooth® 5.4 single-chip combo surpasses Wi-Fi- 6/6E wireless standards with many security features and reliable connectivity. This power-efficient design is optimized for smart home, wearables, and other small applications. It offers a cost-effective balance of advanced Wi-Fi 6E and Bluetooth®/BLE features with performance and power savings to meet IoT connectivity needs.

Infineon Technologies CYW55513 Product Info

16 April 2026 0

Parameters

Antenna Configuration

1x1

Bluetooth Interface

UART/SDIO

Bluetooth Specification

Bluetooth 6.0

Core

Cortex M33

Dimensions

3.57 × 5.32 mm

Family

AIROC™ Wi-Fi + Bluetooth® Combos

Frequency

192 MHz

GPIOs

39

Launch Date

2025

Longevity - 15 years

Yes

Longevity - Extended

No

Operating system support

Linux, Android, RTOS

Operating Temperature range

-40 °C to 85 °C

Operating Voltage range

3 V to 4.8 V

Package

WLBGA-143

Pitch

0.35 mm

Planned to be available until at least

01-01-2040

Product Description

Wi-Fi 6 Combo

ROM

2048 KB

SRAM

768 kByte

Wi-Fi Band

2.4GHz, 5GHz, 6GHz

Wi-Fi Bandwidth

20 MHz

WI-FI Interface

SDIO/SPI

Wi-Fi Specification

Wi-Fi 6E (802.11ax)

Features

  • 1x1, Tri-Band 2.4/5/6GHz, 20MHz Wi-Fi 6E
  • OFDMA, MU-MIMO, TWT, BSS Coloring, DCM
  • STA and SoftAP mode
  • Network offload power save features
  • WPA2 and WPA3 Security
  • SDIO and GSPI Host Interface
  • Bluetooth®/BLE 5.4
  • Bluetooth A2DP, HFP Audio, LE Audio
  • LE long range, 2Mbps, Adv. Extensions
  • UART or SDIO shared with Wi-Fi
  • -40 to +85C operating temperature range
  • Secure boot, encryption, authentication

Description

  • Optimized for IoT applications demands
  • Greenfield 6GHz band for expanded channels
  • Boosts network efficiency
  • Improves range and saves power
  • Bluetooth/BLE Audio hosted or embedded
  • Multi-layer security for more protection

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