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TPS7H4003-SEP
  • TPS7H4003-SEP
  • TPS7H4003-SEP
  • TPS7H4003-SEP

TPS7H4003-SEP

ACTIVE

Radiation-tolerant, 3-V to 7-V, 18-A, synchronous step-down converter in space-enhanced plastic

Texas Instruments TPS7H4003-SEP Product Info

1 April 2026 4

Parameters

Rating

Space

Topology

Buck

Iout (max) (A)

18

Vin (max) (V)

7

Vin (min) (V)

3

Vout (max) (V)

6.65

Vout (min) (V)

0.605

Features

Enable, Frequency synchronization, Over Current Protection, Power good, Pre-Bias Start-Up, Soft Start Adjustable, Synchronous Rectification, Tracking, UVLO adjustable

Control mode

current mode

Operating temperature range (°C)

-55 to 125

Iq (typ) (A)

0.004

Duty cycle (max) (%)

100

Package

HTSSOP (DDW)-44-113.4 mm² 14 x 8.1

Features

  • Radiation performance:
    • SEL, SEB, and SEGR immune up to LET = 43 MeV-cm2/mg
    • SET and SEFI characterized up to LET = 43 MeV-cm2/mg
    • TID assured for every wafer lot up to 50 krad(Si)
  • Peak efficiency: 94% (VO = 1 V at 100 kHz)
  • Integrated 17-mΩ and 9-mΩ MOSFETs
  • Power rail: 3 V to 7 V on VIN
  • Flexible switching frequency options:
    • 100-kHz to 1-MHz adjustable internal oscillator
    • External sync capability: 100kHz to 1MHz
    • SYNC pins can be configured as 500-kHz clocks at 90° out of phase to parallel up to 4 devices
  • 0.6-V ±1.7% voltage reference over temperature, radiation, and line and load regulation
  • Monotonic start-up into prebiased outputs
  • Adjustable slope compensation and soft-start
  • Adjustable input enable and power-good output for power sequencing
  • 44-pin PowerPAD™ HTSSOP package
  • Space Enhanced Plastic:
    • Controlled baseline
    • Au bondwire and NiPdAu lead finish
    • Enhanced mold compound for low outgassing
    • One fabrication, assembly, and test site
    • Extended product life cycle
    • Extended product change notification
    • Product traceability
  • Radiation performance:
    • SEL, SEB, and SEGR immune up to LET = 43 MeV-cm2/mg
    • SET and SEFI characterized up to LET = 43 MeV-cm2/mg
    • TID assured for every wafer lot up to 50 krad(Si)
  • Peak efficiency: 94% (VO = 1 V at 100 kHz)
  • Integrated 17-mΩ and 9-mΩ MOSFETs
  • Power rail: 3 V to 7 V on VIN
  • Flexible switching frequency options:
    • 100-kHz to 1-MHz adjustable internal oscillator
    • External sync capability: 100kHz to 1MHz
    • SYNC pins can be configured as 500-kHz clocks at 90° out of phase to parallel up to 4 devices
  • 0.6-V ±1.7% voltage reference over temperature, radiation, and line and load regulation
  • Monotonic start-up into prebiased outputs
  • Adjustable slope compensation and soft-start
  • Adjustable input enable and power-good output for power sequencing
  • 44-pin PowerPAD™ HTSSOP package
  • Space Enhanced Plastic:
    • Controlled baseline
    • Au bondwire and NiPdAu lead finish
    • Enhanced mold compound for low outgassing
    • One fabrication, assembly, and test site
    • Extended product life cycle
    • Extended product change notification
    • Product traceability

Description

The TPS7H4003-SEP is a radiation-tolerant, 7-V, 18-A synchronous buck converter with integrated low-resistance high-side and low-side MOSFETs in a thermally enhanced 34-pin ceramic flatpack package. High efficiency and reduced component count are achieved through current mode control.

The output voltage start-up ramp is controlled by the SS/TR pin which allows operation as either a stand alone power supply or in tracking situations. Power sequencing is possible by correctly configuring the enable and the power good pins. The TPS7H4003-SEP can be configured in primary-secondary mode and with the SYNC2 pin, four devices can be configured in parallel without an external clock.

Cycle-by-cycle current limiting on the high-side FET protects the device in overload situations and is enhanced by a low-side sourcing current protection which prevents current runaway. There is also a low-side sinking current protection which turns off the low-side MOSFET to prevent excessive reverse current. Thermal shutdown disables the part when die temperature exceeds thermal limit.

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