Product
0
TMS320F2809-Q1
  • TMS320F2809-Q1

TMS320F2809-Q1

ACTIVE

Automotive C2000™ 32-bit MCU with 100 MHz, 256 KB flash, 12 PWM

Texas Instruments TMS320F2809-Q1 Product Info

1 April 2026 0

Parameters

CPU

1 C28

Frequency (MHz)

100

Flash memory (kByte)

256

RAM (kByte)

36

ADC type

12-bit

Total processing (MIPS)

100

Features

2-pin oscillator, 32-bit CPU timers, Watchdog timer

UART

2

CAN (#)

2

Sigma-delta filter

0

PWM (Ch)

12

Number of ADC channels

16

Direct memory access (Ch)

0

SPI

4

QEP

2

USB

No

Operating temperature range (°C)

-40 to 125

Rating

Automotive

Communication interface

CAN, I2C, SPI, UART

Operating system

FreeRTOS

Nonvolatile memory (kByte)

256

Number of GPIOs

35

Number of I2Cs

0

Security

Secure storage

Edge AI enabled

No

Package

LQFP (PZ)-100-256 mm² 16 x 16

Features

  • High-performance static CMOS technology
    • 100 MHz (10-ns cycle time)
    • 60 MHz (16.67-ns cycle time)
    • Low-power (1.8-V core, 3.3-V I/O) design
  • JTAG boundary scan support
    • IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
  • High-performance 32-bit CPU (TMS320C28x)
    • 16 × 16 and 32 × 32 MAC operations
    • 16 × 16 dual MAC
    • Harvard bus architecture
    • Atomic operations
    • Fast interrupt response and processing
    • Unified memory programming model
    • Code-efficient (in C/C++ and Assembly)
  • On-chip memory
    • F2809: 128K × 16 flash, 18K × 16 SARAM F2808: 64K × 16 flash, 18K × 16 SARAM F2806: 32K × 16 flash, 10K × 16 SARAM F2802: 32K × 16 flash, 6K × 16 SARAM F2801: 16K × 16 flash, 6K × 16 SARAM F2801x: 16K × 16 flash, 6K × 16 SARAM
    • 1K × 16 OTP ROM (flash devices only)
    • C2802: 32K × 16 ROM, 6K × 16 SARAM C2801: 16K × 16 ROM, 6K × 16 SARAM
  • Boot ROM (4K × 16)
    • With software boot modes (via SCI, SPI, CAN, I2C, and parallel I/O)
    • Standard math tables
  • Clock and system control
    • On-chip oscillator
    • Watchdog timer module
  • Any GPIO A pin can be connected to one of the three external core interrupts
  • Peripheral Interrupt Expansion (PIE) block that supports all 43 peripheral interrupts
  • Endianness: Little endian
  • 128-bit security key/lock
    • Protects flash/OTP/L0/L1 blocks
    • Prevents firmware reverse-engineering
  • Three 32-bit CPU timers 
  • Enhanced control peripherals
    • Up to 16 PWM outputs
    • Up to 6 HRPWM outputs with 150-ps MEP resolution
    • Up to four capture inputs
    • Up to two quadrature encoder interfaces
    • Up to six 32-bit/six 16-bit timers
  • Serial port peripherals
    • Up to 4 SPI modules
    • Up to 2 SCI (UART) modules
    • Up to 2 CAN modules
    • One Inter-Integrated-Circuit (I2C) bus
  • 12-bit ADC, 16 channels
    • 2 × 8 channel input multiplexer
    • Two sample-and-hold
    • Single/simultaneous conversions
    • Fast conversion rate: 80 ns - 12.5 MSPS (F2809 only) 160 ns - 6.25 MSPS (280x) 267 ns - 3.75 MSPS (F2801x)
    • Internal or external reference
  • Up to 35 individually programmable, multiplexed GPIO pins with input filtering
  • Advanced emulation features
    • Analysis and breakpoint functions
    • Real-time debug via hardware
  • Development support includes
    • ANSI C/C++ compiler/assembler/linker
    • Code Composer Studio™ IDE
    • SYS/BIOS
    • Digital motor control and digital power software libraries
  • Low-power modes and power savings
    • IDLE, STANDBY, HALT modes supported
    • Disable individual peripheral clocks
  • Package options
    • Thin quad flatpack (PZ)
    • MicroStar BGA™ (GGM, ZGM)
  • Temperature options
    • A: –40°C to 85°C (PZ, GGM, ZGM)
    • S: –40°C to 125°C (PZ, GGM, ZGM)
    • Q: –40°C to 125°C (PZ) (AEC-Q100 qualification for automotive applications)
  • High-performance static CMOS technology
    • 100 MHz (10-ns cycle time)
    • 60 MHz (16.67-ns cycle time)
    • Low-power (1.8-V core, 3.3-V I/O) design
  • JTAG boundary scan support
    • IEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan Architecture
  • High-performance 32-bit CPU (TMS320C28x)
    • 16 × 16 and 32 × 32 MAC operations
    • 16 × 16 dual MAC
    • Harvard bus architecture
    • Atomic operations
    • Fast interrupt response and processing
    • Unified memory programming model
    • Code-efficient (in C/C++ and Assembly)
  • On-chip memory
    • F2809: 128K × 16 flash, 18K × 16 SARAM F2808: 64K × 16 flash, 18K × 16 SARAM F2806: 32K × 16 flash, 10K × 16 SARAM F2802: 32K × 16 flash, 6K × 16 SARAM F2801: 16K × 16 flash, 6K × 16 SARAM F2801x: 16K × 16 flash, 6K × 16 SARAM
    • 1K × 16 OTP ROM (flash devices only)
    • C2802: 32K × 16 ROM, 6K × 16 SARAM C2801: 16K × 16 ROM, 6K × 16 SARAM
  • Boot ROM (4K × 16)
    • With software boot modes (via SCI, SPI, CAN, I2C, and parallel I/O)
    • Standard math tables
  • Clock and system control
    • On-chip oscillator
    • Watchdog timer module
  • Any GPIO A pin can be connected to one of the three external core interrupts
  • Peripheral Interrupt Expansion (PIE) block that supports all 43 peripheral interrupts
  • Endianness: Little endian
  • 128-bit security key/lock
    • Protects flash/OTP/L0/L1 blocks
    • Prevents firmware reverse-engineering
  • Three 32-bit CPU timers 
  • Enhanced control peripherals
    • Up to 16 PWM outputs
    • Up to 6 HRPWM outputs with 150-ps MEP resolution
    • Up to four capture inputs
    • Up to two quadrature encoder interfaces
    • Up to six 32-bit/six 16-bit timers
  • Serial port peripherals
    • Up to 4 SPI modules
    • Up to 2 SCI (UART) modules
    • Up to 2 CAN modules
    • One Inter-Integrated-Circuit (I2C) bus
  • 12-bit ADC, 16 channels
    • 2 × 8 channel input multiplexer
    • Two sample-and-hold
    • Single/simultaneous conversions
    • Fast conversion rate: 80 ns - 12.5 MSPS (F2809 only) 160 ns - 6.25 MSPS (280x) 267 ns - 3.75 MSPS (F2801x)
    • Internal or external reference
  • Up to 35 individually programmable, multiplexed GPIO pins with input filtering
  • Advanced emulation features
    • Analysis and breakpoint functions
    • Real-time debug via hardware
  • Development support includes
    • ANSI C/C++ compiler/assembler/linker
    • Code Composer Studio™ IDE
    • SYS/BIOS
    • Digital motor control and digital power software libraries
  • Low-power modes and power savings
    • IDLE, STANDBY, HALT modes supported
    • Disable individual peripheral clocks
  • Package options
    • Thin quad flatpack (PZ)
    • MicroStar BGA™ (GGM, ZGM)
  • Temperature options
    • A: –40°C to 85°C (PZ, GGM, ZGM)
    • S: –40°C to 125°C (PZ, GGM, ZGM)
    • Q: –40°C to 125°C (PZ) (AEC-Q100 qualification for automotive applications)

Description

The TMS320F2809, TMS320F2809-Q1, TMS320F2808, TMS320F2808-Q1 TMS320F2806, TMS320F2802, TMS320F2801-Q1, TMS320F28015-Q1, TMS320F28016-Q1, TMS320C2802-Q1, and TMS320C2801 devices, members of the TMS320C28x DSP generation, are highly integrated, high-performance solutions for demanding control applications.

Throughout this document, TMS320F2809, TMS320F2809-Q1 TMS320F2808, TMS320F2808-Q1 TMS320F2806, TMS320F2802-Q1, TMS320F2801-Q1, TMS320C2802, TMS320C2801, TMS320F28015-Q1, and TMS320F28016-Q1 are abbreviated as F2809, F2808, F2806, F2802-Q1, F2801-Q1, C2802, C2801, F28015-Q1, and F28016-Q1, respectively. TMS320F28015-Q1 and TMS320F28016-Q1 are abbreviated as F2801x. Device Comparison (100-MHz Devices) and Device Comparison (60-MHz Devices) provide a summary of features for each device.

The TMS320F2809, TMS320F2809-Q1, TMS320F2808, TMS320F2808-Q1 TMS320F2806, TMS320F2802, TMS320F2801-Q1, TMS320F28015-Q1, TMS320F28016-Q1, TMS320C2802-Q1, and TMS320C2801 devices, members of the TMS320C28x DSP generation, are highly integrated, high-performance solutions for demanding control applications.

Throughout this document, TMS320F2809, TMS320F2809-Q1 TMS320F2808, TMS320F2808-Q1 TMS320F2806, TMS320F2802-Q1, TMS320F2801-Q1, TMS320C2802, TMS320C2801, TMS320F28015-Q1, and TMS320F28016-Q1 are abbreviated as F2809, F2808, F2806, F2802-Q1, F2801-Q1, C2802, C2801, F28015-Q1, and F28016-Q1, respectively. TMS320F28015-Q1 and TMS320F28016-Q1 are abbreviated as F2801x. Device Comparison (100-MHz Devices) and Device Comparison (60-MHz Devices) provide a summary of features for each device.

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