Product
0
TMP144
  • TMP144
  • TMP144
  • TMP144

TMP144

ACTIVE

Low-power, digital temperature sensor with SMAART Wire™ / UART interface

Texas Instruments TMP144 Product Info

1 April 2026 3

Parameters

Local sensor accuracy (max)

1

Type

Local

Operating temperature range (°C)

-40 to 125

Supply voltage (min) (V)

1.4

Interface type

UART

Supply voltage (max) (V)

3.6

Features

Daisy chain

Supply current (max) (µA)

3

Temp resolution (max) (bps)

12

Remote channels (#)

0

Addresses

16

Rating

Catalog

TI functional safety category

Functional Safety-Capable

Package

DSBGA (YBK)-4-0.847364 mm² 1.142 x 0.742

Features

  • Multiple Device Access (MDA):
    • Global read/write operations
  • SMAART Wire™ / UART interface
  • Resolution: 12-bit or 0.0625°C
  • ±1°C maximum (–10°C to +100°C)
  • ±2°C maximum (–40°C to +125°C)
  • Low quiescent current:
    • 3-µA active I Q at 0.25 Hz
    • 0.6-µA shutdown
  • Supply range: 1.4 V to 3.6 V
  • Push-pull digital output
  • Package:
    • 0.76 mm × 0.96 mm, 150-µm maximum height, 4-ball YMT (DSBGA)
    • 0.76 mm × 0.96 mm, 310-µm maximum height, 4-ball YBK (DSBGA)
    • 0.76 mm × 0.96 mm, 625-µm maximum height, 4-ball YFF (DSBGA)
  • Multiple Device Access (MDA):
    • Global read/write operations
  • SMAART Wire™ / UART interface
  • Resolution: 12-bit or 0.0625°C
  • ±1°C maximum (–10°C to +100°C)
  • ±2°C maximum (–40°C to +125°C)
  • Low quiescent current:
    • 3-µA active I Q at 0.25 Hz
    • 0.6-µA shutdown
  • Supply range: 1.4 V to 3.6 V
  • Push-pull digital output
  • Package:
    • 0.76 mm × 0.96 mm, 150-µm maximum height, 4-ball YMT (DSBGA)
    • 0.76 mm × 0.96 mm, 310-µm maximum height, 4-ball YBK (DSBGA)
    • 0.76 mm × 0.96 mm, 625-µm maximum height, 4-ball YFF (DSBGA)

Description

The TMP144 digital output temperature sensor can read temperatures to a resolution of 0.0625°C.

The device has a SMAART Wire™ / UART interface that supports daisy-chain configurations. The interface also supports Multiple Device Access (MDA) commands that let the host communicate with multiple devices on the bus simultaneously. MDA commands are used as an alternative to sending individual commands to each device on the bus. Up to 16 TMP144 devices can be attached together serially and can be read by the host computer.

The TMP144 device is designed for space-constrained, power-sensitive applications with multiple temperature measurement zones that must be monitored. The device is specified for operation over a temperature range of –40°C to 125°C and is available in three different 4-ball, low-height wafer chip-scale package (DSBGA) options. The YMT package of the device has a height of 150 µm, which is 40% thinner than a 0201 resistor. The thinner YMT package can be placed under heat-dissipating components on the system for better accuracy and faster thermal response times.

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8