0
Number of channels |
1 |
Total supply voltage (+5 V = 5, ±5 V = 10) (max) (V) |
10 |
Total supply voltage (+5 V = 5, ±5 V = 10) (min) (V) |
2.7 |
Rail-to-rail |
In to V-, Out |
GBW (typ) (MHz) |
0.51 |
Slew rate (typ) (V/µs) |
0.18 |
Vos (offset voltage at 25°C) (max) (mV) |
3 |
Iq per channel (typ) (mA) |
0.055 |
Vn at 1 kHz (typ) (nV√Hz) |
19 |
Rating |
Catalog |
Operating temperature range (°C) |
-40 to 85 |
Offset drift (typ) (µV/°C) |
1 |
Input bias current (max) (pA) |
60 |
CMRR (typ) (dB) |
83 |
Iout (typ) (A) |
0.01 |
Architecture |
CMOS |
Input common mode headroom (to negative supply) (typ) (V) |
-0.3 |
Input common mode headroom (to positive supply) (typ) (V) |
-0.8 |
Output swing headroom (to negative supply) (typ) (V) |
0.125 |
Output swing headroom (to positive supply) (typ) (V) |
-0.125 |
SOT-23 (DBV)-5-8.12 mm² 2.9 x 2.8
Hz Typ at f = 1 kHzAdvanced LinCMOS is a trademark of Texas Instruments Incorporated.
The TLV2221 is a single low-voltage operational amplifier available in the SOT-23 package. It offers a compromise between the ac performance and output drive of the TLV2231 and the micropower TLV2211.
It consumes only 150 µA (max) of supply current and is ideal for battery-powered applications. The device exhibits rail-to-rail output performance for increased dynamic range in single- or split-supply applications. The TLV2221 is fully characterized at 3 V and 5 V and is optimized for low-voltage applications.
The TLV2221, exhibiting high input impedance and low noise, is excellent for small-signal conditioning for high-impedance sources, such as piezoelectric transducers. Because of the micropower dissipation levels combined with 3-V operation, these devices work well in hand-held monitoring and remote-sensing applications. In addition, the rail-to-rail output feature with single or split supplies makes this family a great choice when interfacing with analog-to-digital converters (ADCs).
With a total area of 5.6mm2, the SOT-23 package only requires one third the board space of the standard 8-pin SOIC package. This ultra-small package allows designers to place single amplifiers very close to the signal source, minimizing noise pick-up from long PCB traces. TI has also taken special care to provide a pinout that is optimized for board layout. Both inputs are separated by GND to prevent coupling or leakage paths. The OUT and IN- terminals are on the same end of the board to provide negative feedback. Finally, gain setting resistors and decoupling capacitor are easily placed around the package.