0
Number of channels |
3 |
Rating |
Automotive |
Forward/reverse channels |
2 forward / 1 reverse |
Integrated isolated power |
No |
Isolation rating |
Reinforced |
Default output |
High, Low |
Data rate (max) (Mbps) |
50 |
Protocols |
GPIO, PWM, UART |
Surge isolation voltage (VIOSM) (VPK) |
10000 |
Transient isolation voltage (VIOTM) (VPK) |
7071 |
Withstand isolation voltage (VISO) (Vrms) |
5000 |
CMTI (min) (V/µs) |
100000 |
Operating temperature range (°C) |
-40 to 125 |
Supply voltage (max) (V) |
5.5 |
Supply voltage (min) (V) |
1.71 |
Propagation delay time (typ) (µs) |
0.011 |
Current consumption per channel (DC) (typ) (mA) |
1 |
Current consumption per channel (1 Mbps) (typ) (mA) |
1.65 |
Creepage (min) (mm) |
8 |
Clearance (min) (mm) |
8 |
TI functional safety category |
Functional Safety-Capable |
SOIC (DW)-16-106.09 mm² 10.3 x 10.3
The ISO6731-Q1 device is a high-performance, triple-channel digital isolators ideal for cost-sensitive applications requiring up to 5000 VRMS isolation ratings per UL 1577. This device is also certified by VDE, TUV, CSA, and CQC.
The ISO6731-Q1 devics provides high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by TIs double capacitive silicon dioxide (SiO2) insulation barrier. This device comes with enable pins which can be used to put the respective outputs in high impedance for multi-master driving applications. The ISO6731-Q1 device has two forward and one reverse-direction channels. In the event of input power or signal loss, the default output is high for the device without suffix F and low for the device with suffix F. See Device Functional Modes section for further details.
Used in conjunction with isolated power supplies, this device helps prevent noise currents on data buses, such as CAN and LIN from damaging sensitive circuitry. Through innovative chip design and layout techniques, the electromagnetic compatibility of the ISO6731-Q1 device has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO6731-Q1 device is available in a 16-pin SOIC wide-body (DW) package and is a pin-to-pin upgrade to the older generations.