Processor Cores:

• Dual-core Arm Cortex-R5F MCU subsystem operating up to 400MHz, highly-integrated for real-time processing

  • Dual-core Arm® Cortex®-R5F cluster supports dual-core and single-core operation
  • 32KB I-Cache and 32KB D-Cache per R5F core with SECDED ECC on all memories
  • Single-core: 128KB TCM per cluster (128KB TCM per R5F core)
  • Dual-core: 128KB TCM per cluster (64KB TCM per R5F core)
• C66x DSP core
  • Single core, 32-bit, floating point DSP
  • Operating up to 550MHz (17.6 GMAC)

Memory subsystem:

• Up to 5.0MB On Chip RAM (OCSRAM)
  • Memory space sharable between DSP, MCU, and shared L3
  • 3.5625MB shared L3 memory
  • 960KB dedicated to Main subsystem
  • 384KB dedicated to DSP subsystem
• External Memory Interfaces (EMIF)
  • QSPI interface operating up to 67MHz

System on Chip (SoC) Services and Architecture:

• 12x EDMA for various subsystems, MCU, DSP and Accelerator cores
• 5x Real-Time Interrupt (RTI) modules
• Mailbox system for Interprocessor Communication (IPC)
• JTAG/Trace interfaces for device debugging
• Clock source
  • 40.0MHz crystal with internal oscillator
  • Supports external oscillator at 40/50MHz
  • Supports externally driven clock (Square/Sine) at 40/50MHz

High-speed Serial Interfaces:

• 10/100Mbps Ethernet (RGMII/RMII/MII)
• Input: 2x 4-lane MIPI D-PHY CSI 2.0 Data
• Output: 4-lane Aurora/LVDS

General Connectivity Peripherals:

• General Purpose Analog to Digital Converters (GPADC)
  • 1x 9-channel ADC supporting up to 625Ksps
• Digital Connectivity
  • 4x Serial Peripheral Interface (SPI) controllers operating up to 25MHz
  • 3x Inter-Integrated Circuit (I2C) ports
  • 4x Universal Asynchronous Receiver-Transmitters (UART)
  • 3x Multi-channel Audio Serail Port (McASP)
  • Audio Tracking Logic (ATL)

Industrial and control interfaces:

• 3x Enhanced Pulse-Width Modulator (ePWM)
• 1x Enhanced Capture Module (eCAP)
• 2x Modular Controller Area Network (MCAN) modules with CAN-FD support

Power Management:

• Recommend LP87745-Q1 Power Management ICs (PMIC)
• Simplified power sequencing and reduced number of power supply rails
• Dual voltage digital I/O supporting 3.3V and 1.8V operation

Security:

• Device Security
  • Programmable embedded Hardware Security Module (HSM)
  • Secure authenticated and encrypted boot support
  • Customer programmable root keys, symmetric keys (256 bit), Asymmetric keys (up to RSA-4K or ECC-512) with Key revocation capability
  • Crypto hardware accelerators - PKA with ECC, AES (up to 256 bit), TRNG/DRBG

Functional Safety:

• Functional Safety Quality Managed
  • Documentation will be available to aid ISO 26262 functional safety system design
• AEC-Q100 Qualified
• Operating Conditions
  • Extended automotive grade temperature range supported
  • Extended industrial grade temperature range supported

Package options:

• ZCE (285-pin) nFBGA package 13mm x 13mm, 0.65 mm pitch
• NZN (225-pin) nFBGA package 13mm x 13mm, 0.80 mm pitch