0
S80KS5122GABHM023
  • S80KS5122GABHM023

S80KS5122GABHM023

Active and preferred

S80KS5122GABHM023 is a 512 Mb HYPERRAM™ self-refresh DRAM with a 1.8 V HYPERBUS™ interface for high-bandwidth embedded memory expansion. It supports DDR transfers up to 200 MHz and 400 MBps, with 35 ns max access time. The 24-ball FBGA runs from 1.7 V to 2.0 V and -40°C to 125°C (AEC-Q100 Grade 1), and includes interface standby, hybrid sleep, and deep power-down (30 µA at 105°C).

Infineon Technologies S80KS5122GABHM023 Product Info

16 April 2026 0

Parameters

Density

512 MBit

Family

KS-2

Initial Access Time

35 ns

Interface Bandwidth

400 MByte/s

Interface Frequency (SDR/DDR) (MHz)

- / 200

Interfaces

HYPERBUS

Lead Ball Finish

Sn/Ag/Cu

Operating Temperature range

-40 °C to 125 °C

Operating Voltage range

1.7 V to 2 V

Operating Voltage

1.8 V

Peak Reflow Temp

260 °C

Planned to be available until at least

See roadmap

Qualification

Automotive

Technology

HYPERRAM

Features

  • HyperBus interface
  • 1.7 V to 2.0 V VCC supply
  • Single or differential clock input
  • 8-bit DDR bus with RWDS strobe
  • 200 MHz maximum clock rate
  • Up to 400 MBps data throughput
  • 35 ns maximum access time tACC
  • Burst: linear or wrapped
  • Wrap bursts: 16/32/64/128 bytes
  • Interface standby ignores I/O pins
  • Active clock stop after tACC+30 ns
  • Hybrid sleep via CR1[5], data kept

Description

  • 400 MBps supports fast buffering
  • DDR boosts bandwidth per pin
  • 1.8 V I/O matches low-voltage SoCs
  • RWDS strobe eases timing closure
  • Linear burst fits streaming reads
  • Wrap bursts match cache line fills
  • Standby reduces idle power draw
  • Clock stop saves power on stalls
  • Hybrid sleep keeps RAM contents
  • HS entry in 3 us reduces wake cost
  • HS exit in 100 us improves response
  • Deep power down cuts leakage

Subscribe to Welllinkchips !
Your Name
* Email
Submit a request