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S-MFC6.6
  • S-MFC6.6

S-MFC6.6

With the MFC6.x product series Infineon offers black lined premium Flip Chip packages with an equivalent appearance like epoxy tape.In combination with an optimized card cavtiy this products offer advantages for mechanical robustness, module flatness in card and improved image of card backside in area of module milling cavity.For the Payment market this products are also availablel with palladium surface.

Infineon Technologies S-MFC6.6 Product Info

16 April 2026 0

Parameters

Applications

payment, government identification

Contact Surface

NiAu

Delivery Forms

Tape on Reel

Derivatives

Pd surface, Au surface

Dimensions

11 x 8.3mm

ISO – Reference

ISO 7816-1, ISO 7810, ISO 10373-1/-3

Pitch

9.5 mm

Product Description

contact-based module, 6 contacts

Product Name

S-MFC6.6

Thickness

max. 420µm

Features

  • 9.5mm
  • 11 x 8.3mm
  • max. 470µm
  • NiAu
  • ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Au surface, Pd surface, S-MFC6.6-6-1, S-MFC6.6-6-3
  • Tape on Reel

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