Product
0
FS950R08A6P2B
  • FS950R08A6P2B

FS950R08A6P2B

Active and preferred

The HybridPACK™ Drive module with EDT2 IGBT and Diode is an automotive qualified power module designed for Hybrid- and Electric Vehicle applications . The product FS950R08A6P2B comes with a PinFin baseplate and performance ceramic.

Infineon Technologies FS950R08A6P2B Product Info

16 April 2026 11

Parameters

Applications

Drives, CAV, eMobility, Hybrid Electric Vehicles

Configuration

Sixpack

Cooling Concept

PinFin baseplate

Dimensions (length)

152 mm

Dimensions (width)

92 mm

Features

Short Tabs

Housing

HybridPACK™ Drive

IC(nom) / IF(nom)

950 A

IC max

1900 A

Launch year

2019

Planned to be available until at least

2034

Qualification

Automotive

Technology

IGBT EDT2

VCE(sat) (Tvj=25°C typ)

1.1 V

VCES (Tvj=25°C typ)

750 V

Voltage Class max

750 V

Apps

EV traction inverter

Features

  • Blocking voltage 750V
  • Low VCEsat
  • Low Switching Losses
  • Low Qg and Cres
  • Low Inductive Design
  • Tvjop = 150°C
  • Short-time ext Op Tvj op = 175°C

Description

  • Compact Design
  • Integrated NTC temperature sensor
  • PressFIT Contact Technology
  • RoHS compliant
  • Mechanical guiding elements

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8