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P-MCS8-2-1
  • P-MCS8-2-1

P-MCS8-2-1

The P-MCS8-2-1 is a economical thin module (< 250µm) allowing: integration of additional security layer, possibility of very thin inlays, additional layer to reduce card cracks, higher card quality (more coverage over chip). It uses the proven lead frame design from the P-MCC8-2-6. With its standard dimensions and due to its compatible design existing sets of production settings e.g. for thermo compression can be used and allow a easy change over.

Infineon Technologies P-MCS8-2-1 Product Info

16 April 2026 0

Parameters

Applications

payment, government identification

Contact Surface

Ag

Delivery Forms

Tape on Reel

Dimensions

8.1 x 5.15mm

ISO – Reference

ISO 7816-1, ISO 7810, ISO 10373-1/-3, ISO 14443

Pitch

9.5 mm

Product Description

thin contactless module, mold

Product Name

P-MCS8-2-1

Thickness

max. 250µm

Features

  • 9.5mm
  • 8.1 x 5.15mm
  • max. 250µm
  • Ag
  • ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Tape on Reel

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