0
P-MCC8-2-6
  • P-MCC8-2-6

P-MCC8-2-6

The P-MCC8-2-6 is an optimized contactless module that works as a 1:1 replacement for the existing MCC8-2-3/MOB4 modules: No change in thickness (shape and chip); No change in shape size (4.80 x 5.10 mm); Optimized for smaller ICs; Fully compatible with existing production equipment and settings. The Contactless Module MCC8-2-3 has been discontinued and is no longer available.

Infineon Technologies P-MCC8-2-6 Product Info

16 April 2026 0

Parameters

Applications

payment, transport ticketing, government identification

Contact Surface

Ag

Delivery Forms

Tape on Reel

Dimensions

8.1 x 5.15mm

ISO – Reference

ISO 7816-1, ISO 7810, ISO 10373-1/-3, ISO 14443

Pitch

9.5 mm

Product Description

standard contactless module, mold

Product Name

P-MCC8-2-6

Thickness

max. 340μm

Features

  • 9.5mm
  • 8.1 x 5.15mm
  • max. 340μm
  • Ag
  • ISO 7816-1, ISO 7810, ISO 10373-1/-3
  • Tape on Reel

Subscribe to Welllinkchips !
Your Name
* Email
Submit a request