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IM70D122
  • IM70D122

IM70D122

Active and preferred

Infineon's high-performance digital XENSIV™ MEMS microphone, IM70D122, uses Sealed Dual Membrane (SDM) technology to achieve a 70 dB(A) signal-to-noise ratio. With high sensitivity and SNR, it's perfect for advanced audio capturing that enhances the audio experience for laptops and tablets. SDM MEMS technology provides high IP57 ingress protection.

Infineon Technologies IM70D122 Product Info

16 April 2026 0

Parameters

AEC-Q103-003 qualified

on demand

AOP

122 dBSPL

Current Consumption

980 µA

Green

RoHS compliant, Halogen free

Interfaces

Digital PDM

LFRO

30 Hz

Package dimensions

3.50 x 2.65 x 0.98 mm³

Sensitivity

-26 dBFS

SNR

70 dB(A)

Supply Voltage

1.62 - 3.60 V

Apps

AI and data center, Semiconductor solutions for home entertainment applications

Features

  • Very high 70dB(A) Signal-to-noise ratio
  • Very high sensitivity (-26 dBFS)
  • Selectable power modes for battery critical applications (980/260µA)
  • Sealed Dual Membrane (SDM) technology with IP57 ingress protection at microphone level
  • Acoustic overload point (AOP) of 122dBSPL
  • Very tight part-to-part phase and sensitivity matching (± 1dB)
  • Flat frequency response with a low LFRO (low frequency roll-off) of 30Hz

Description

  • Far-field and low volume audio pick-up
  • Crystal clear audio signals even at high sound pressure levels
  • Enablement of advanced audio features (audio zoom, beamforming)

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