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IDDD08G65C6
  • IDDD08G65C6

IDDD08G65C6

Infineon Technologies introduces Double DPAK (DDPAK), the first top-side cooled surface mount device (SMD) package addressing high power SMPS applications such as PC power, solar, server and telecom. The benefits of the already existing high voltage technology CoolSiC™ Schottky diode 650V G6 is combined with the innovative concept of top-side cooling, providing a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.

Infineon Technologies IDDD08G65C6 Product Info

16 April 2026 0

Parameters

I(FSM) max

47 A

IF max

8 A

IR

0.8 µA

Package

D-DPAK

Ptot max

90 W

QC

12.2 nC

Qualification

Industrial

RthJC

1 K/W

VF

1.25 V

Apps

Light electric vehicle solutions, Telecommunications infrastructure, DIN rail power supply solutions

Features

  • Offers best-in-class VF and FOM Qc x VF
  • Improved dv/dt ruggedness
  • Easy and effective match with CoolMOS™ 7 SJ MOSFET families
  • Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
  • Reduced parasitic source inductance improves e iciency and ease-of-use
  • Enables higher power density solutions
  • Exceeding the highest quality standards

Description

  • Enabling highest energy efficiency
  • Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
  • Reduced parasitic source inductance improves e iciency and ease-of-use
  • Enables higher power density solutions
  • Exceeding the highest quality standards

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