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IAUCN10S7L040
  • IAUCN10S7L040

IAUCN10S7L040

Active and preferred

IAUCN10S7L040 is an automotive MOSFET built with Infineon’s leading edge, power semiconductor technology; OptiMOS™ 7 100V.  This product is offered in our versatile, robust, high current SSO8 5x6mm² SMD package.  It is designed specifically for high performance, high quality and the robustness needed for demanding automotive applications.

Infineon Technologies IAUCN10S7L040 Product Info

16 April 2026 0

Parameters

Country of Assembly (Last BE site, current, subject to change)

Indonesia, Malaysia

Country of Diffusion (Last FE site, current, subject to change)

Austria, Germany

ID (@25°C) max

120 A

Launch year

2025

Operating Temperature range

-55 °C to 175 °C

Package

PG-TDSON-8

Planned to be available until at least

2038

Polarity

N

QG (typ @10V) max

66 nC

QG (typ @10V)

50.6 nC

Qualification

Automotive

RDS (on) (@10V) max

3.95 mΩ

Technology

OptiMOS™7

VDS max

100 V

VGS(th) range

1.2 V to 2 V

VGS(th)

1.6 V

Apps

Domain controller for ADAS & autonomous driving, Auxiliary motor control 48 V, Automotive power distribution, Zonal DC-DC converter 48 V-12 V, Zone control unit, Automotive LED front single light functions, Full LED headlight system - multi-channel LED driver, Automotive battery management system (BMS) - 48 V, Automotive battery protection & disconnection, Automotive electric pumps & fans 48 V, Light electric vehicle solutions

Features

  • Low on-resistance, RDS(on)
  • Leading edge FOM (RDS (on) x Qg)
  • Fast switching times (turn on/off)
  • High avalanche current capability
  • High SOA ruggedness
  • Tight threshold voltage, VGS(th), range
  • Excellent thermal performance
  • Low package resistance and inductance
  • Unique fused source pins
  • Extended qualification beyond AEC-Q101
  • Enhanced electrical testing
  • MSL1 up to 260°C peak reflow

Description

  • Very low conduction losses
  • Superior switching performance
  • Highest power density in 5x6mm package
  • High power efficiency
  • Small footprint & efficient cooling
  • Well suited for parallel placement
  • Increased design ruggedness
  • Better solder joint reliability
  • Designed for Automotive robustness
  • High quality production for Automotive

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