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FS980R08A7F32B
  • FS980R08A7F32B

FS980R08A7F32B

Active and preferred

The power module combines the latest EDT3 IGBT 750V and second generation CoolSiC™ Automotive MOSFET 750V, optimized for electric drive train applications, from mid- to high-range automotive power classes to high-range commercial, construction, and agricultural vehicles.

Infineon Technologies FS980R08A7F32B Product Info

16 April 2026 0

Parameters

Configuration

Sixpack

Cooling Concept

PinFin baseplate

Features

Short Tabs, PinFin baseplate

Housing

HybridPACK™ Drive G2

IC max

980 A

Launch year

2026

Planned to be available until at least

2040

Qualification

Automotive

Technology

IGBT EDT3, CoolSiC™ G2

VCES (Tvj=25°C typ)

750 V

Voltage Class max

750 V

Features

  • EDT3 IGBT/Diode & CoolSiC Gen2 MOSFET
  • Optimized for simultaneous gate drive
  • Integrated on-chip temperature sensor
  • Low conduction and switching losses
  • Low inductive design
  • Tvj,op = 175°C
  • 4.25kV DC 1s insulation
  • High power density
  • Direct-cooled PinFin base plate
  • PressFIT contact technology
  • High-performance Si3N4 ceramic
  • Guiding elements for PCB & cooler assembly

Description

  • Higher temperature cycling capability
  • Integrated on-chip temperature sensor
  • New plastic material
  • Better temperature capability
  • Improved thermal conductivity
  • Lower system BOM
  • Lower AC contact resistance
  • Lower tab temperature
  • PressFIT Contact Technology
  • RoHS compliant
  • Completely Pb free
  • Superior reliability

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