FS55MR12W1M1H_B11

Active and preferred

EasyPACK™ 1B 1200 V / 55 mΩ sixpack module with CoolSiC™ MOSFET with enhanced generation 1, NTC and PressFIT Contact Technology .

Infineon Technologies FS55MR12W1M1H_B11 Product Info

16 April 2026 1

Parameters

Applications	UPS,Servo Drives,Solar,EV Charging
Configuration	Sixpack
Dimensions (width)	33.8 mm
Dimensions (length)	62.8 mm
Features	PressFIT
Housing	Easy 1B
Qualification	Industrial
RDS (on) (@ Tj = 25°C)	52.9 mΩ

Apps

Automotive, Refrigerators and freezers, EV charging, General purpose motor drive, Servo motor drive and control, Photovoltaic, Uninterruptible power supplies (UPS)

Features

Best-in-class package: 12 mm height
Easy module packages
Very low module stray inductance
Low and equal gate inductances
Symmetrical internal chip layouts
Wide RBSOA
1200 V CoolSiC™ MOSFET
Gate drive vol.: +15…+18 V & 0…-5 V
Max. gate-source v.: +23 V & -10 V
T_vjop under overload condi. < 175°C
PressFIT pins

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ELECTRONIC COMPONENTS
All In One Distributor

FS55MR12W1M1H_B11

EasyPACK™ 1B 1200 V / 55 mΩ sixpack module with CoolSiC™ MOSFET with enhanced generation 1, NTC and PressFIT Contact Technology .

Infineon Technologies FS55MR12W1M1H_B11 Product Info

Parameters

Apps

Features

SUBMITTED SUCCESSFULLY！

ELECTRONIC COMPONENTS All In One Distributor

FS55MR12W1M1H_B11

EasyPACK™ 1B 1200 V / 55 mΩ sixpack module with CoolSiC™ MOSFET with enhanced generation 1, NTC and PressFIT Contact Technology .

Infineon Technologies FS55MR12W1M1H_B11 Product Info

Parameters

Apps

Features

SUBMITTED SUCCESSFULLY！

ELECTRONIC COMPONENTS
All In One Distributor