Product
0
FS25R12W1T4_B11
  • FS25R12W1T4_B11

FS25R12W1T4_B11

Active and preferred

EasyPACK™1B 1200 V, 25 A sixpack IGBT module with TRENCHSTOP™ IGBT4, Emitter Controlled 4 diode, NTC and PressFIT Contact Technology. Also available as variation with Soldering connection technology: FS25R12W1T4 . This module can be replaced easily with FS25R12W1T7_B11 for more power with TRENCHSTOP™ IGBT7

Infineon Technologies FS25R12W1T4_B11 Product Info

16 April 2026 0

Parameters

Configuration

Sixpack

Dimensions (length)

48 mm

Dimensions (width)

33.8 mm

Features

PressFIT

Housing

EasyPACK™ 1B

IC(nom) / IF(nom)

25 A

IC max

25 A

Qualification

Industrial

Technology

IGBT4 - T4

VCE(sat) (Tvj=25°C typ)

1.85 V

VF (Tvj=25°C typ)

1.75 V

Voltage Class max

1200 V

Apps

General purpose motor drive, Residential air conditioning, Motor control, Uninterruptible power supplies (UPS)

Features

  • Low switching losses
  • Trench IGBT4
  • VCEsatwith positive temp. coeffi.
  • Low VCEsat
  • Al2O3 substrate
  • Compact design
  • PressFIT contact technology
  • Rugged mounting
  • Integrated mounting clamps

Subscribe to Welllinkchips !
Your Name
* Email
Popular Posts
Featured Parts More >
Submit a request
CONTACT US
Company address

WELL LINK CHIPS GROUP CO.,LIMITED FLAT/RM 1802 BEVERLY HOUSE 93-107 LOCKHART ROAD WANCHAI HK

Send Enquiry
SEND e-MAIL
Office hour from 9am to 6pm ,
Monday through Friday, UTC/GMT +8